Unlock instant, AI-driven research and patent intelligence for your innovation.

Multiple stage type print circuit board of probe card

A technology of printed circuit boards and probe cards, which is applied to printed circuits, printed circuit components, and measurement electronics, and can solve problems such as insufficient test depth

Inactive Publication Date: 2009-05-13
MPI CORP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the main purpose of the present invention is to provide a multi-level printed circuit board of a probe card, which can increase the overall thickness of the probe card under the condition of meeting the test specifications of the existing test machine, so as to solve the test problem. The problem of insufficient depth

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multiple stage type print circuit board of probe card
  • Multiple stage type print circuit board of probe card
  • Multiple stage type print circuit board of probe card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Please refer to FIG. 1 to FIG. 3 , which is a multi-step printed circuit board 100 of a probe card provided by the first preferred embodiment of the present invention, which mainly includes a clamping body 10 and a growth body 20, wherein:

[0015] The clamping body 10 is a printed circuit board (Printed Circuit Board, PCB) with a predetermined outline, which can define a first end surface 11 and a second end surface 12 opposite to the first end surface 11, The clamping body 10 can be made of materials such as FR-4, FR-5 or Polyimide (PI), BT, etc., which are laminated under high pressure and high temperature. Stated and electrically connected circuit wiring 13 is shown in FIG. 3 , and at the center positions of the first end surface 11 and the second end surface 12, connection terminals 14 are respectively formed in a predetermined range and electrically connected to the circuit wiring; The thickness of the clamping body 10 is within the size range that can be clamped ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention comprises: a grip body in which there is a circuit layout with a defined shape and whose edge can be gripped by a test machine; an attached body in which there is a conducting line with a defined shape, which is attached to the lower portion of the grip body not being gripped in order to form a scalariform faller between the grip body and the attached body, and connect the conducting line in the attached body to the circuit in the grip body.

Description

technical field [0001] The present invention is related to a probe card, and more specifically refers to a multi-level printed circuit board of a probe card. Background technique [0002] General integrated circuits must first pass the circuit test by the probe card before packaging, through which defective products can be screened out and the yield rate of the final product can be improved. [0003] However, the structure of a general vertical probe card generally has a printed circuit board (PCB), a transfer substrate (Substrate) and a vertical probe head (Probe Head), wherein the transfer substrate is based on one of the One side is connected to the circuit board and is electrically connected with the circuit board, and the vertical probe base is connected to the other side of the adapter substrate, through the vertical probe base built in the vertical probe base The probes can be electrically connected with the circuit board through the adapter substrate. However, sinc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K1/02G01R31/00
Inventor 吕福进简志忠
Owner MPI CORP