Separating and assembling semiconductor strips

Abstract

A method and an apparatus for separating elongated semiconductor strips (630) from a wafer (400) of semiconductor material are disclosed. Vacuum (500) is applied to the face of each semiconductor strip forming an edge of the wafer (400) or being adjacent to the edge. The wafer (400) and the source of the vacuum (500) are displaced to separate each elongated semiconductor strip (630) from the wafer (400), Further a method and an apparatus for assembling elongated semiconductor strips (630) separated from a wafer (400) of semiconductor material into an array of strips (630) are disclosed. Still further, methods, apparatuses, and systems for assembling an array of elongated semiconductor strips (630) on a substrate are also disclosed.

Description

technical field [0001] The present invention relates generally to semiconductor processing, and more particularly to assembling arrays of semiconductor elongated bars. Background technique [0002] The solar photovoltaic cell industry is susceptible to high costs in terms of the efficiency with which solar cells generate voltage and the cost of producing solar cells. Because only a small fraction of the total thickness of a solar cell is used to generate voltage, minimizing the thickness of the solar cell and yielding more solar cells from a single silicon wafer is particularly important. [0003] "Slim strip" solar cells and A way to make sliver solar cells like this in order to increase the usable surface area of ​​a semiconductor wafer. The wafer has a substantially planar surface and a thickness dimension at right angles to the substantially planar surface, and the wafer is typically monocrystalline or polycrystalline silicon. [0004] In the method of Internation Pub...

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Problems solved by technology

Going a step further, slender strips have the disadvantage of potentially stacking on top of each other

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