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Minisize ultrasonic transducer with flexible base plate

An ultrasonic and transducer technology, applied in the field of miniature ultrasonic transducers, can solve the problems of reducing the resolution and characteristics of components, increasing the attenuation coefficient of components, and unable to produce flexible deformation, so as to achieve improved sensing sensitivity and efficiency, Reduce the effect of impedance and matching layers

Active Publication Date: 2009-06-24
IND TECH RES INST
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  • Abstract
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  • Application Information

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Problems solved by technology

However, the feature of this structure is that silicon is used as the base material 91 and the support column 92 is a hard material, which cannot produce flexible deformation. Matching, but it also increases the attenuation coefficient of the component and reduces the resolution and characteristics of the component. If it can be made with a flexible substrate, the above problems will be solved.

Method used

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  • Minisize ultrasonic transducer with flexible base plate
  • Minisize ultrasonic transducer with flexible base plate
  • Minisize ultrasonic transducer with flexible base plate

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Embodiment Construction

[0029] Such as Figure 1~2 As shown, the micro ultrasonic transducer unit 1 includes a substrate 10, an oscillating film 20, a plurality of first electrodes 31 and second electrodes 32, and the micro ultrasonic transducer is composed of a plurality of micro ultrasonic transducer units 1. , Where: a substrate 10 is made of flexible material, on which is provided a first surface 11 and a second surface 12; the upper end of the first surface 11 is formed with a groove 13, and on both sides The support 14 can be made of a flexible material or a non-flexible material. The materials of the substrate 10, the support 14 and the oscillating film 20 are Silicone (silicone) Si3N4 (silicon nitride) Polysilicon (polysilicon), kapton, Ni( Nickel) Telflon (Teflon), resin, plastic, polyester, polyimide, photoResist (photoresist) or polymer materials, etc., wherein the bracket 14 and the substrate 10 can also be integrated with the same material, which also belongs to the scope of the present inve...

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Abstract

A micro-ultrasonic transducer with a flexible substrate, which includes: a substrate, which is made of a flexible material, provided with an upper surface and a lower surface, and a lower electrode is arranged between the upper and lower surfaces. Both sides of the upper surface of the substrate are provided with brackets to form a supporting structure; and a shock film is provided with an upper surface and a lower surface, an upper electrode is arranged between the upper surface and the lower surface, and is connected to the lower electrode in a On the power supply; the lower surface of the vibrating membrane is set on the bracket; with the above combination, the multiple goals of reducing the manufacturing steps and increasing the deformation capacity of the vibrating membrane can be achieved without increasing the cost, and it is beneficial to the improvement of sensing sensitivity and performance.

Description

Technical field [0001] The invention relates to an ultrasonic transducer, in particular to a micro ultrasonic transducer with a flexible substrate. Background technique [0002] Conventional ultrasonic sensing uses a transducer to convert energy into mechanical energy, so that the probe emits an elastic wave to the surface of the object to be measured. The elastic wave is transmitted in the object. When it encounters a discontinuous interface, an echo will be generated. The probe receives the echo signal and judges it to obtain the result. [0003] Ultrasonic sensing system is one of the most widely used testing equipment, and its core component is composed of related ultrasonic sensors. As far as ultrasonic sensors are concerned, "miniaturization" is currently the key trend of active global development. The reason is that it has the advantages of high response, high resolution and wide application. Conventional ultrasonic sensors are mostly in the form of coupling, and most of t...

Claims

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Application Information

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IPC IPC(8): G01N29/00G01N29/24
Inventor 邓泽民樊天柱李国骧张明赖志敏邱家麟张明
Owner IND TECH RES INST
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