Supercharge Your Innovation With Domain-Expert AI Agents!

Method and device for sticking tape

A sticking device, sticking roller technology, applied in the direction of bonding methods, adhesives, transportation and packaging, etc., can solve the problem of wafer warping and deformation that has not been completely solved

Active Publication Date: 2009-07-01
LINTEC CORP
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the problem of wafer warpage is not completely solved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for sticking tape
  • Method and device for sticking tape
  • Method and device for sticking tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0107] Embodiments of the present invention will be described below with reference to the accompanying drawings. figure 1 is a set of front views for illustrating the paste operation according to the method of the present invention. figure 2 is a set of front views involving the gluing of frame members for illustrating the method according to the invention. image 3 for figure 2 top view.

[0108] Such as figure 1 As shown, a tape having a size corresponding to the adherend 14 is prepared in advance, and by sticking the tape on the support film 10 , the support film is pressed to stick the tape 12 to the adherend 14 .

[0109] When the tape is attached to the adherend 14, the supporting film remains in a flat state with tension ( figure 1 (a)). In this state, the tape 12 affixed to the support film 10 remains under less tension as the tension is maintained on the thick laminate of the support film 10 and tape 12 and diffuses into the support film 10 .

[0110] The t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The tape (12), (12)... is attached to the long support film (10), and the support film (10) is contained in the frame member (18) after the tape (12) is pasted to the adherend (14). The positions in the frame are attached to the frame members (18). The support film (10) is pressed to stick the tape (12) to the adherend (14), and the support film (10) is detached from the tape (12). The support film (10) is conveyed and the above operation is repeated to stick the tapes (12), (12)... to the respective adherends (14), (14).... The tension of the belt (12) is transmitted to the support film (10) and the frame members (18) block the tension of the support film (10) outside the frame. Therefore, the tape (12) stuck to the adherend (14) has reduced residual stress so that warping and deformation of the adherend to which the tape is stuck can be prevented.

Description

technical field [0001] The present invention relates to methods and apparatus for adhering tapes to adherends such as semiconductor wafers. More particularly, the present invention relates to a method and apparatus for preventing distortion of an adherend to which a tape is attached. Background technique [0002] During semiconductor manufacturing, circuits are formed on the surface of a semiconductor wafer (referred to herein simply as a "wafer") and the backside of the wafer is ground to obtain a thin and uniform thickness and to remove the oxide layer on the backside. [0003] The step of polishing the backside of the wafer (back grinding step) includes sticking a protective tape to the surface of the wafer with circuits to protect the circuit surface. [0004] In the usual method of attaching the protective tape to the wafer, such as Figure 14 As shown, paste a protective tape having a size larger than the peripheral diameter of the wafer, then insert the dicing knife ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B65H37/04C09J5/00H01L21/68B65H18/10B65H37/00H01L21/00
CPCB65H37/002H01L2221/68395H01L2221/6839H01L21/67132H01L21/48
Inventor 中山武人
Owner LINTEC CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com