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Illumination assembly and method of making same

A technology for lighting components and components, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of poor light reflectivity, poor thermal conductivity, and expensive circuitized substrates.

Inactive Publication Date: 2009-08-19
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these techniques and designs provide sometimes poor thermal conductivity from the LED package to the heat sink, the circuitized substrates used can be expensive, and provide poor light reflectivity

Method used

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  • Illumination assembly and method of making same
  • Illumination assembly and method of making same
  • Illumination assembly and method of making same

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Embodiment Construction

[0019] The present invention is applicable to lighting assemblies, and more particularly, to lighting assemblies that use LEDs to provide illumination. The lighting assemblies disclosed herein can be used for general lighting purposes (eg, to illuminate an area) or, as in an information display, to provide information to a viewer by selecting different areas of the lighting assembly. Such assemblies are suitable for use in backlit displays, signs and other lighting applications requiring large amounts of light.

[0020] The lighting assembly of the present invention includes an LED designed to be attached to a substrate using any number of suitable techniques (eg, press-fit, piercing, screwing, etc.). The substrate is thermally conductive so that heat can be conducted away from the LEDs. In some embodiments, the substrate is also conductive, providing a circuit path for the LEDs. Additionally, in some embodiments, the assembly can include a dielectric layer positioned adjace...

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Abstract

The invention discloses a lighting assembly (200). The lighting assembly includes a thermally conductive substrate (212), a patterned conductive layer (218) located near a main surface (214) of the thermally conductive substrate, and a patterned conductive layer disposed on the patterned conductive layer. and a dielectric layer (216) between the major surface of the substrate, and at least one LED (220) including a post (230) connected to the thermally conductive substrate such that the post At least a portion of is embedded in the thermally conductive substrate. The at least one LED may be thermally connected to the thermally conductive substrate through the posts and electrically connected to the patterned conductive layer. The dielectric layer may be reflective.

Description

technical field [0001] The present invention generally relates to lighting assemblies or lighting assemblies. More particularly, the present invention relates to lighting assemblies or lighting assemblies using arrays of light emitting diodes (LEDs). Background technique [0002] Lighting assemblies are used in a wide variety of applications. For example, conventional lighting assemblies use light sources such as incandescent or fluorescent light sources. More recently, other types of light emitting elements, particularly light emitting diodes (LEDs), have been used in lighting assemblies. LEDs have the advantages of small size, long life and low power consumption. These advantages of LEDs make them useful in many different applications. [0003] For many lighting applications, it is desirable to have one or more LEDs to provide the desired light intensity and / or distribution. For example, several LEDs can be assembled in a small-sized array to provide high illumination...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/60H01L33/64
CPCH05K1/056H01L33/642H05K1/021H05K2201/10409H05K2201/10106H05K1/182H01L2224/48091H01L2924/3025H01L33/60H01L2924/00014H01L2924/00
Inventor 安德鲁·J·欧德科克洪·T·陈约翰·C·舒尔茨约翰·A·惠特利约瑟夫·A·霍夫曼凯-乌韦·申克迈克尔·A·梅斯史帝芬·J·波亚尔沃尔夫冈·N·伦哈特
Owner 3M INNOVATIVE PROPERTIES CO