Solder paste printing system
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HITACHI LTD
- Publication Date
- 2009-09-23
- Estimated Expiration
- Not applicable Β· inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The present invention relates to a screen printing device, and more particularly to a printing device for printing solder paste and a printing system using the same. Background technique
[0002] As a conventional screen printing machine, there is a device disclosed in JP-A-5-200975. The screen printing machine has: a stage portion with a substrate carrying in conveyor, a substrate carrying out conveyor, and a lifting mechanism; a mask having a transfer pattern as an opening; a squeegee, a squeegee lifting mechanism, and a horizontal direction. Applicator heads for moving mechanisms; controls for controlling these mechanisms. After placing the substrate loaded into the device on the stage, raise the stage part to bring the substrate close to the mask, and fill the opening of the mask with milky solder or the like while touching the mask to the substrate with a squeegee. Then, by lowering the stage part, the substrate and the mask are separated, and t...