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Sound wave needle inserting system for micro needle array plaster

A technology of microneedle array and patch, applied in the field of devices related to transdermal drug delivery technology, can solve the problems of easy bending, insufficient hardness, different depth of needle insertion, etc., and achieve the effect of reducing discomfort and avoiding differences

Active Publication Date: 2009-09-30
SUZHOU NASHENG MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The biggest disadvantage of inserting microneedles into the skin by hand is that each person uses different strengths, resulting in significant differences in the depth of insertion. Even for the same person, the depth of insertion is different due to the difference in the strength of each insertion.
The use of an automatic needle inserter is to insert the microneedle array into the skin instantly under a certain force, and has the following disadvantages: (1) Because the nature of the skin is different, the depth of insertion is different; (2) If you want to make the needle deeper , need to have a relatively large elasticity, there is discomfort near the wound
This needle introducer can improve the repeatability of needle insertion, but it cannot account for the variation caused by different skins
However, no matter whether it is a hand prick or an automatic needle inserter, a certain force is required to make the microneedle array penetrate the skin. Because the microneedle array of polymer materials and some metal materials is usually tough but not hard enough, it is difficult to penetrate the skin or easily bend

Method used

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  • Sound wave needle inserting system for micro needle array plaster
  • Sound wave needle inserting system for micro needle array plaster
  • Sound wave needle inserting system for micro needle array plaster

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment one: see attached figure 1 to attach image 3 As shown, a sonic needle insertion system for a microneedle array patch includes a fixed ring 40 and an acoustic vibration generator 10. The lower part of the inner edge of the fixed ring 40 is provided with a fixed ring piece 41 extending inward, and the sound wave vibration generates The device 10 extends into the fixed ring 40, and the lower end is positioned by the gel gasket 20 and the fixed ring piece 41. The bottom surface of the gel gasket 20 is pasted with an adhesive positioning patch 32 to form a microneedle array patch installation position; wherein, The working frequency of the acoustic vibration generator 10 is 10HZ~100KHZ, the output power is less than 60W, the diameter is 1~3 cm, its outer surface is smooth, and the outer surface is provided with a corrosion-resistant material layer; The distance between the bottom ends of the fixing ring 40 is 1-5 mm, and the thickness of the fixing ring piece 41...

Embodiment 2

[0026] Embodiment 2: An acoustic wave needle insertion system for a microneedle array patch, including a fixed ring and an acoustic vibration generator, the lower part of the inner edge of the fixed ring is provided with an inwardly extending fixed ring piece, and the acoustic wave vibration generator extends into the In the fixed ring, the lower end is positioned by the gel gasket and the fixed ring piece, and the positioning patch is pasted on the bottom surface of the gel gasket to form the installation position of the microneedle array patch; wherein, the working frequency of the acoustic vibration generator is 200HZ~ 20KHZ, the output power is less than 60W, the diameter is 0.5-10 cm, the outer surface is smooth, and the outer surface is provided with a corrosion-resistant material layer; the distance from the fixed ring piece to the bottom of the fixed ring is 1-3 mm, and the fixed ring piece The thickness is 300-500 microns. The fixed ring and the acoustic vibration gen...

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Abstract

The invention discloses an acoustic wave needle insertion system for a microneedle array patch, which is characterized in that it includes a fixed ring and a sound wave vibration generator, and the lower part of the inner edge of the fixed ring is provided with a fixed ring sheet extending inward, and the sound wave vibrates The generator extends into the fixed ring, the lower end is positioned by the gasket and the fixed ring, and the bottom surface of the gasket is pasted with a positioning patch to form the installation position of the microneedle array patch; wherein, the working frequency of the acoustic vibration generator is 10HZ~ 100KHZ, the output power is less than 60W, and the position of the fixed ring piece is such that the distance from the adhesive patch to the bottom surface of the fixed ring is greater than the height of the corresponding microneedle array patch. The invention can reduce the discomfort near the pain point of the patient, keep the penetration depth consistent on various types of skin, and avoid the difference caused by different skins.

Description

technical field [0001] The invention relates to a device related to the transdermal drug delivery technology, in particular to a device for repeatedly piercing a microneedle array chip which enhances the permeability of the transdermal drug delivery into the skin stratum corneum. Background technique [0002] Most drugs are currently administered orally in the form of tablets, capsules, etc. However, due to drug degradation in the gastrointestinal tract and the first-pass effect in the liver, many orally administered drugs are largely or completely ineffective before reaching the site of action. Another common way of administration is injection, including subcutaneous injection and intravenous infusion, which enables the drug to penetrate biological barriers (such as skin, mucous membrane, and vascular barrier). Although this method is effective, the injection will bring additional pain to the patient, and it is easy to cause local skin damage and bleeding at the injection ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00A61M5/00
Inventor 徐百高云华
Owner SUZHOU NASHENG MICROELECTRONICS CO LTD