Thin membrane encapsulation structure of fingerprint identifying device

Abstract

The invention relates to a thin film enclosing structure of a fingerprint identifier, comprising a fingerprint identifier chip, a plurality of projecting blocks, a plurality of virtual projecting blocks, a circuit film and sealing colloids. A sensing area is formed on an active surface of the fingerprint identifier chip. The above projecting blocks are arranged on the active surface and are located at one lateral end of the sensing area, and the above virtual projecting blocks are also arranged on the active surface and are located at the opposite lateral end of the sensing area. The circuit film is equipped with a through opening to expose the sensing area and includes a plurality of pins and virtual pins to respectively join the above projecting blocks and virtual projecting blocks, wherein all the outer ends of the pins are confluent at the same side of the circuit film. The sealing colloids are used to seal the above projecting blocks and virtual projecting blocks, thereby reaching the balance of thermo-compression bonding and engagement and facilitating to form the sealing colloids.

Description

technical field [0001] The present invention relates to a fingerprint sensor package, in particular to a thin film packaging structure of a fingerprint sensor. Background technique [0002] The packaging structure of the fingerprint reader can be additionally installed in various electronic products, such as mobile phones, notebook computers, personal digital assistants (PDA, or palmtop computers), etc., to identify users' fingerprints. At present, the fingerprint reader can be manufactured and packaged by using semiconductor manufacturing process. Different from the traditional IC package, the fingerprint reader chip should have an exposed sensing area to be able to identify fingerprints. However, the traditional packaging structure of fingerprint readers uses the traditional substrate and mold packaging technology. The interfaces for mechanical fixing and electrical connection are all located on the bottom surface of the substrate, which makes it difficult to control the h...

AI Technical Summary

Problems solved by technology

The technical method is to first seal the glue and then press a soft board on one side of the chip, which will have the disadvantage of overflowing glue and polluting the sensing area, and cannot continue to use the existing tape-and-reel packaging process and equipment.

[0005] It can be seen that the above-mentioned existing fingerprint reader packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the problems of the packaging structure of the fingerprint reader, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems , this is obviously a problem that relevant industry players are eager to solve

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