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Peltier low temperature differential heat analyzer

An analyzer and micro-thermal technology, applied in the field of thermal analysis and testing, can solve the problems of high equipment cost, long control cycle, difficult control, etc., and achieve the effect of low cost, compact structure and fast response

Inactive Publication Date: 2009-11-11
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The traditional methods used for thermal analysis measurement include liquid nitrogen or compression refrigeration. These methods have long control cycles, serious hysteresis, difficult control, and high equipment costs.

Method used

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Embodiment 1

[0018] Such as figure 1 shown. Press the following parts to figure 1 Those skilled in the art can successfully implement the connection in the manner shown. The device is composed of the second sensor 3, the crystallizer 2, the chip 4, the heat pump 11 and the temperature / heat flow measurement and power control device 7 connected sequentially. The first sensor 1 adopts a Pt100 probe type platinum thermal resistance, and the crystallizer adopts a 35*18 *25mm metal crystallizer, the second sensor 3 adopts Pt100 thin-plate platinum thermal resistance, chip 4 adopts TEC1-12704T125 semiconductor cooling chip, sealing device 5 adopts 100*100*102mm metal sealing groove, temperature / heat flow measuring device 6 adopts XMTH -7000 intelligent digital display controller, temperature / heat flow measurement and power control device 7 adopts TCA-808 program controller, modulus A / D conversion device 8 adopts ADAM-4015 module, computer 9 adopts P4 processor PC, printer 10 The Lenovo 7000 pr...

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Abstract

The invention belongs to the technical field of thermal analysis and testing, and in particular relates to a Peltier low-temperature micro-thermal analyzer. It is composed of sensor, crystallizer, heat pump chip, sealing device, temperature / heat flow measuring device, temperature / heat flow measuring and power control device, analog-to-digital conversion device, data processing device, the sealing device is hollow in the middle, sensor, crystallizer and chip Located in the sealing device, the chip is located at the bottom of the sealing device, the crystallizer is located above the chip, there is a groove on the top of the crystallizer, and a sensor is installed in the groove; there is a sensor on the side of the crystallizer, and the sensor is connected to the temperature / heat flow measurement and power through a wire The control device, the sensor is connected to the temperature / heat flow measuring device through wires, the other end of the temperature / heat flow measuring device is connected to an analog-to-digital conversion device, the analog-to-digital conversion device is connected to a computer, and the computer is connected to a printer. The invention has high measurement precision and automatic degree, and can be used for the research of crystal nucleation mechanism, solid-liquid phase equilibrium research and crystallization mechanism research of various organic systems such as DNA, protein, high molecular polymer and medicine.

Description

technical field [0001] The invention belongs to the technical field of thermal analysis and testing, and in particular relates to a Peltier low-temperature micro-thermal analyzer. Background technique [0002] The Peltire effect is that when current flows through the interface of two different conductors, heat will be absorbed from the outside world, or heat will be released to the outside world. The semiconductor heat pump chip is based on this effect. When an N-type semiconductor (electronic type) and a P-type semiconductor (hole type) are connected to form a galvanic pair and the power is turned on, energy transfer can occur. N-type and P-type semiconductors generate electrons and holes respectively. The current flowing from the N-type element to the joint of the P-type element absorbs heat called the cold end, and the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. The characteristic of the semiconductor h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/00
Inventor 黄民郭思斯郭艳姿李佟茗
Owner TONGJI UNIV