Method for embedding heat conductive element on circuit board
A heat-conducting element and circuit board technology, which is applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problem that the heat-conducting sheet 90 falls off, affects the processing operation of the circuit board 80, and it is difficult to ensure the bonding effect of the heat-conducting sheet 90 and the circuit board 80, etc. Problems, to avoid falling off, to ensure the effect of stability
Inactive Publication Date: 2009-12-16
敬鹏(常熟)电子有限公司
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Problems solved by technology
[0004] The above-mentioned technical means of forcing the pressing block 91 of the heat conduction sheet 90 into the hole 82 correspondingly formed on the circuit board 80 and having the electroplating layer 81 has a defect in that: due to the difference in the size of the pressing block 91, Therefore, it is often difficult to ensure the bonding effect between the heat conduction sheet 90 and the circuit board 80 , thus causing the heat conduction sheet 90 to fall off from the hole 82 of the circuit board 80 , affecting the subsequent processing of the circuit board 80
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[0029] The embedding method of the heat conduction element on the circuit board of the present invention includes the following steps, namely: providing the circuit board, primary electroplating, embedding and installing the heat conduction sheet and secondary electroplating, specifically as follows:
[0030] A) provide a circuit board 10, see figure 1 , processing a through mounting hole 11 on the provided circuit board 10;
[0031] B) Primary plating, see figure 2 , the inner wall of the mounting hole 11 and the surroundings of the mounting hole 11 are electroplated with copper to form a first electroplating layer 15 of copper. The surroundings of the mounting hole 11 described here refer to a suitable area surface around the mounting hole 11, and the above-mentioned The above-mentioned appropriate surface is determined according to different requirements, for example, within the range of 1-2cm around the installation hole 11;
[0032] C) Flush mount heat spreader, see ...
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A method for embedding a heat conduction element on a circuit board belongs to the technical field of circuit board processing. The method includes the following steps: providing a circuit board, and processing a mounting hole on the circuit board; electroplating once, electroplating the inner wall and surroundings of the mounting hole to form a first electroplating layer; embedding and installing a heat conducting sheet, placing a metal and surrounding side edge The heat conduction sheets with pressing blocks distributed at intervals are embedded and installed in the installation hole through the guide device, and the outer edge part of the pressing block enters the first electroplating layer on the hole wall of the installation hole and the first electroplating layer is pressed against each other. Abutment; secondary plating, plating on the inner wall of the mounting hole to cover the first plating layer and the second plating layer to cover the thermal conductive sheet and the exposed part of the pressing block that is not wedged into the first plating layer , make the pressing block closely connected with the second electroplating layer, and leave a gap between the heat conducting sheet and the second electroplating layer on the inner wall of the mounting hole at the position between adjacent pressing blocks.
Description
technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for embedding a heat conduction element on a circuit board. Background technique [0002] As automotive products continue to advance in the direction of perfection, the degree of integration of electronic semiconductor technology into automotive products is increasing. Many functions of automotive products have been filled by electronic semiconductor devices, which means that electronic components occupy a certain amount in automotive products. Proportion. As far as the automobile brake control system (ABS) widely used by automobile manufacturers is concerned, its main function is to use electronic devices to control the hydraulic pressure, and to control the brake pressure in steps to avoid wheel lockup, which is what people are used to call. ABS. Because the ABS brake control system can act at a frequency of more than 10 times per second,...
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IPC IPC(8): H05K3/00H05K7/20
Inventor 林万礼
Owner 敬鹏(常熟)电子有限公司