Semiconductor memory card

Abstract

A semiconductor memory card which inputs / outputs signals by connecting to an external device, has a circuit board on an upper surface of which board terminals connected to board wiring are formed, and on a lower surface of which input / output card terminals for inputting / outputting signals to / from the external device, a power supply card terminal for supplying electric power, and a ground card terminal connected to ground potential by connecting to the external device are provided; a nonvolatile memory chip which is mounted on the upper surface of the circuit board, and has a plurality of first bonding pads formed close to a first side of the nonvolatile memory chip in a manner that the plurality of first bonding pads are wire-bonded to a plurality of first board terminals formed on the circuit board along the first side; and a controller chip which is mounted on the nonvolatile memory chip, and has a plurality of second bonding pads formed in a manner that the plurality of second bonding pads are wire-bonded to a plurality of second board terminals formed on the circuit board along a second side of the nonvolatile memory chip, adjacent to the first side, and which controls the nonvolatile memory chip, wherein the power supply card terminal or the ground card terminal has a connection can be connected to the external device and an extension extended from the connection in a manner that the connection and the extension are along the first board terminals and the second board terminals via the circuit board.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from Japanese Patent Application No. 2006-014616 filed on January 24, 2006, and the entire content of this original patent application is hereby incorporated by reference. technical field [0003] The present invention relates to a semiconductor memory card having a power card terminal for supplying power and a ground card terminal connected to a ground potential. Background technique [0004] In recent years, the size and weight of mobile phones and computers incorporating nonvolatile memory chips have been increasing, and the demand for larger memories and products with various functions has been increasing. [0005] Take xD-Picture (TM) A semiconductor memory card represented by a memory card is mainly used as a storage medium of a digital camera. The semiconductor chip structure of this semiconductor memory card requires a flash memory which is a nonvolatile memory...

AI Technical Summary

Problems solved by technology

[0011] Therefore, for example, when the board terminal and the power card terminal or the ground card terminal are arranged separately, the wiring length from the board terminal to the power card terminal or the ground card terminal is increased, and the responsiveness of the semiconductor memory card may not be improved. , to achieve low power consumption, etc.

In addition, due to the complexity of the substrate wiring structure, etc., there is a problem that crosstalk (crosstalk) between substrate wirings may occur

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