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Heat sink, electronic device, and tuner apparatus

A heat dissipation device and electronic device technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of time-consuming installation methods

Inactive Publication Date: 2007-08-08
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an installation method is time-consuming due to the need to push the screw 171 into the housing 152 and the fin 112.

Method used

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  • Heat sink, electronic device, and tuner apparatus
  • Heat sink, electronic device, and tuner apparatus
  • Heat sink, electronic device, and tuner apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0147] FIG. 1 is a plan view from above of an electronic device equipped with a heat sink 1 according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the electronic device viewed from arrow II in FIG. 1 .

[0148] The heat sink 1 according to the embodiment of the present invention is composed of a plurality of heat dissipating members 10 . The heat dissipating member 10 is provided with a body portion 11 and a fin portion 12 , and an extension portion 14 is formed in the fin portion 12 . In addition, an engaging portion 15 is formed at the tip of the extension portion 14 .

[0149] The size of each heat dissipating member 10 is changed, but in order to simplify the following description, when there is no need to distinguish them, they are handled together as the heat dissipating member 10, and only when necessary, by adding lowercase to the reference numeral "10" letter (such as "a") to distinguish them.

[0150] The heat sink 1 is mount...

Embodiment 2

[0199] FIG. 18 is a plan view from above of an electronic device provided with a heat sink 201 according to Embodiment 2 of the present invention. FIG. 19 is a perspective view of the heat sink 201 viewed obliquely from above. FIG. 20 is a plan view of the heat sink 201 viewed from above. FIG. 21 is a side view of the heat sink 201 .

[0200] The heat sink 201 according to the present embodiment is assembled by stacking a plurality of heat dissipating members 210 at the main body portion 11 . This structure is similar to Embodiment 1, and thus its description is omitted. Also, the specific structure of the heat dissipating member 210 is substantially similar to Embodiment 1, so its description is omitted here.

[0201] Here, the extending direction of the extending portion 214 is different, so this point will be described.

[0202] The extension portion 214 is formed by extending the fin 12 in the heat dissipating member 210 selected as desired. The extension portion 214 ...

Embodiment 3

[0205] FIG. 22 is a top view of an electronic device provided with a heat sink 301 according to Embodiment 3 of the present invention viewed from above. FIG. 23 is a perspective view of the heat sink 301 viewed obliquely from above. FIG. 24 is a cross-sectional view of the engagement portion of the heat sink 301 viewed from arrow XXIV.

[0206] The heat sink 301 according to the present embodiment is assembled by stacking a plurality of heat dissipating members 310 at the main body portion 11 . This type of structure is similar to Embodiment 1, so its description is omitted here. Also, the specific structure of the heat dissipating member 310 is substantially similar to Embodiment 1, so a description thereof is omitted here.

[0207] Here, the extending direction of the extending portion 314 is different, so this point will be described.

[0208] The extension portion 314 is formed by extending the fin 12 in the heat dissipating member 310 selected as needed. The extension...

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PUM

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Abstract

The invention provides a heat sink fitted to an electronic component, ueat sink, electronic device, and tuner apparatus. The heat sink comprises a plurality of heat dissipating members having a flat main body portion and a fin portion formed by extending the main body portion are provided, and at least one of the heat dissipating members further has an extended portion formed by extending the fin portion or the main body portion, and an engaging portion formed in a tip of the extended portion.

Description

technical field [0001] The present invention relates to a heat sink structure which can be engaged with constituent members of an electronic device, and to an electronic device and a tuner device provided with such a heat sink. Background technique [0002] An electronic device is configured by mounting electronic components constituting a circuit on a mounting substrate. Among electronic components, especially ICs (Integrated Circuits) have highly integrated semiconductor elements and may reach high temperatures due to the use of electricity. The operation of an IC reaching a high temperature may become unstable, so the IC is equipped with a heat sink. [0003] 49 is a perspective view of an electronic device with a heat sink mounted to an electronic component. [0004] The heat sink 101 is mounted to the back of the IC 151 as an electronic component, absorbs heat so that the IC 151 does not become over a predetermined temperature, and dissipates the heat into the surroun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/40H05K7/20
CPCH01L23/3672H01L2924/0002H01L2924/00H05K7/20
Inventor 伊藤秋雄山内美芳土居昭彦
Owner SHARP KK