Light-emitting diode package structure

Abstract

This invention relates to a package structure of a LED, which adds an insulation backing layer between a conduction base plate and a LED, and the package structure includes a heat conduction base plate with a pit, an insulation backing set on the pit of said heat-conduction base plate and a LED set on said insulation backing and connected with an outside supply by lead, in which, circuit can be made on the insulation backing, which can increase light emission efficiency of the LED.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure, in particular to a light-emitting diode packaging structure in which an insulating base material is placed between the light-emitting diode and a heat-conducting bottom plate. Background technique [0002] In current light emitting diode (LED; light emitting diode) packaging structures, two methods, eutectic (Eutectic) and conductive adhesive, are generally used as the main way of combining the light emitting diode and the heat-conducting substrate. The method is mainly to combine the bottom of the light-emitting diode with the heat-conducting bottom plate (such as a metal bracket) through the above-mentioned method to achieve the effects of solidification, heat dissipation and conduction. Generally, the light emitting diodes are located in the recesses of the heat conduction base, however, problems may arise when the material of the heat conduction base is metal. [0003] Since some...

AI Technical Summary

Problems solved by technology

The general light-emitting diodes are located in the pit of the heat-conducting base, but when the material of the heat-conducting base is metal, there will be problems

[0003] Since some metal heat-conducting base plates are formed by cold forge process, the surface roughness of the metal material will be poor, especially the surface roughness of the forming edge.

Therefore, the rough surface of the molding edge of the metal heat-conducting bottom plate will affect the effect of light reflection of the light-emitting diode, and then affect the overall light extraction efficiency of the light-emitting diode.

Moreover, the rough surface of the metal heat-conducting base plate will also affect the surface bonding strength between the light-emitting diode and the heat-conducting base plate, reducing the reliability of the LED packaging structure (Reliability)

[0004] In addition, the difference in coefficient of thermal expansion (CTE; coefficient of thermal expansion) between the heat-conducting base plate (such as a metal bracket) and the light-emitting diodes will cause stress and pull on the surface where the heat-conducting base plate and the light-emitting diodes are combined when the heat expands and contracts. Phenomenon, so it is easy to produce gaps (void) or easy to cause delamination problems at the junction

[0005] It can be seen that the above-mentioned existing light-emitting diode packaging structure obviously still has inconvenience and defects in use, and needs to be further improved urgently.

In order to solve the problems existing in the packaging structure of light-emitting diodes, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems. Obviously, it is a problem that relevant industry players are eager to solve.

Images