Packaging structure and method for super-thin optical fingerprint interception module

Abstract

The invention discloses an ultrathin optical fingerprint intercepting module packaging structure, comprising: a circuit board, an image sensing module, a lighting module and a packaging cover body, where the image sensing module and the lighting module are both arranged electrically on the circuit board; the packaging cover body is arranged on the circuit board and has a first opening unit for exposing the image sensing module and a second opening unit for exposing the lighting module. Therefore, the invention implements an ultrathin structure by reducing packaging structure volume and then can reduce the manufacturing cost and raise the product yield.

Description

technical field [0001] The invention relates to a packaging structure and a packaging method of an ultra-thin optical fingerprint interception module, in particular to a packaging structure and a packaging method which omit a complicated and difficult-to-assemble optical mechanism. Background technique [0002] Please refer to FIG. 1 and FIG. 2 , which are respectively an exploded perspective view and a side sectional view of a package structure of a conventional optical fingerprint capture module. It can be seen from the figure that the package structure of the known optical fingerprint capture module includes: a package case 10a, a circuit board 20a, a cover glass 30a, an image sensing component 40a, a lens component 50a and a light emitting component 60a. [0003] Wherein, the circuit board 20a and the upper cover glass 30a are respectively disposed on the upper and lower ends of the packaging case 10a, thereby creating upper and lower spaces 100a, 200a, the image sensing...

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Problems solved by technology

[0004] However, as can be seen from FIG. 1 and FIG. 2, the volume of the optical mechanism part of the packaging structure of the known

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