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Heat radiating assembly and electronic appliance radiating heat using the same

A technology for electronic equipment and radiator, which is applied in the field of heat dissipation combination and electronic equipment using heat dissipation combination to dissipate heat, can solve the problems of low heat dissipation efficiency, fan stator blades and radiator not coordinating fan design and radiator thermal design, etc. The effect of cooling efficiency

Inactive Publication Date: 2007-09-26
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It can be seen that during the heat dissipation process of the radiator, the fan vane only plays the role of increasing the static pressure of the airflow. The fan vane and the radiator do not coordinate the relationship between the fan design and the radiator thermal design, and the heat dissipation efficiency lower

Method used

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  • Heat radiating assembly and electronic appliance radiating heat using the same
  • Heat radiating assembly and electronic appliance radiating heat using the same
  • Heat radiating assembly and electronic appliance radiating heat using the same

Examples

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Embodiment Construction

[0026] The embodiment of the present invention utilizes the supercharging effect of the vane of the fan, and through coordinated design, the vane is also made into a mode with the characteristics and functions of a radiator, that is, the supercharging effect of the vane is also used to dissipate heat.

[0027] The technical solutions of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] Referring to FIG. 1 , it is a schematic structural diagram of a heat dissipation combination according to an embodiment of the present invention. The heat dissipation combination is a structure that uses a vane device on the air outlet side to dissipate heat.

[0029] According to the figure, the heat dissipation combination at least includes fan wheel 1 , stationary vane device 3 and fan frame 2 for fixing fan wheel 1 and stationary vane device 3 . Wherein, the fan wheel 1 at least includes a hub 11, and a pluralit...

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Abstract

The disclosed heat dispersion assembly for an electronic device comprises: a turbofan with a wheel hub and some rotating blades around the hub, a fan frame for fixing the turbofan, and a metal-made static blade device set on input or / and output side of the frame to guide air flow and boost flow static pressure and connect with heat source directly or indirectly for conducting. This invention is benefit to improve heat dispersion efficiency.

Description

technical field [0001] The invention relates to a cooling device such as a heat exchanger, in particular to a heat dissipation combination and electronic equipment using the heat dissipation combination to dissipate heat. Background technique [0002] With the development of microelectronics technology, the integration of electronic products is getting higher and higher. However, electronic components will generate heat when they work. If the heat is not dissipated in time, it will affect the service life of electronic components and the performance of the entire electronic product. Therefore, generally, a heat dissipation fan or other heat dissipation combination is installed inside the electronic product to dissipate heat to the outside of the electronic product. [0003] The general heat dissipation method is to drive the airflow through the radiator through the static pressure of the fan, and exchange heat with the radiator, thereby taking away the heat, that is, the fan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467
Inventor 张运辉
Owner HUAWEI TECH CO LTD
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