Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Computer system and input/output plate

A computer system, input and output technology, applied to instruments, electrical digital data processing, etc., can solve problems such as unsmooth heat dissipation channels, and achieve the best heat dissipation effect

Inactive Publication Date: 2007-10-03
HUANDA COMPUTER (SHANGHAI) CO LTD
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the board-to-board parallel connection structure between the expansion board 13 and the bottom board 12 makes the cooling channel less smooth.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Computer system and input/output plate
  • Computer system and input/output plate
  • Computer system and input/output plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are listed below and described in detail in conjunction with the accompanying drawings.

[0025] Please refer to FIG. 2 , a preferred embodiment of the present invention provides a computer system (computing system) 2 and its I / O board (I / O board) 21 . The I / O board 21 includes a south bridge chip 212, an I / O controller (I / O controller) 213, and a number of I / O ports 210, preferably including a PS / 2 connection port, a USB connection port, a LAN connection port, and an IDE connection. Port, SATA connection port, audio connection port or disk connection port, etc., to provide external functions for peripheral devices. Since the type or quantity of the input and output ports 210 is not intended to limit the present invention, the number of input and output ports 210 can be increased or decreased correspondingly according to the needs of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a computer system and its input / output machine plate. Said computer system includes at least a processor card, an expansion plate and input / output machine plate, in which the processor card has at least one processor, the expansion plate includes at least one expansion slot, and the input / output machine plate includes south bridge chip, input / output controller and several input / output ports. Said invention utilizes at least one processor bus connector and several interconnected bus connectors to make south bridge chip, processor and expansion slot form communication.

Description

technical field [0001] The present invention relates to a computer system (computing system) and its input / output board (I / O board). Background technique [0002] A multi-processor system allows an operating system to be executed on a host computer with multiple processors, and fully utilizes the computing power of each processor. This kind of computer system can assign multiple programs executed at the same time to different processors for execution, so as to speed up the execution speed of the programs. Therefore, the transmission between processors and the transmission between processors and other chipsets becomes an important key point. [0003] There has never been an ever-satisfied need for computer equipment to increase the speed of signal transmission. Nowadays, it is an era when high-speed bus technologies are coming out one after another. From chip-to-chip, board-to-board to chassis-to-chassis, there have been A variety of interconnect technologies with high lin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F13/00
Inventor 罗启荣
Owner HUANDA COMPUTER (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products