A kind of encapsulation method and encapsulation structure of high-power LED

A technology of LED packaging and packaging method, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of increasing the power of LED chips restricting the service life of high-power LEDs, reducing the luminous efficiency of LED chips, and reducing the conversion efficiency of phosphors, etc. Achieve the effect of prolonging the service life, improving the fluorescence conversion efficiency, and reducing the temperature
CN105870294BInactive Publication Date: 2019-03-29SHANGHAI GUOYU OPTOELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI GUOYU OPTOELECTRONICS TECH CO LTD
Publication Date
2019-03-29
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention provides a packaging method and structure of a high-power LED and belongs to field of semi-conductor devices. A solid transmitting heat conducting window layer is arranged above an LED chip. A box dam is arranged around the LED chip. By arranging a box dam structure, the solid transmitting heat conducting window layer serves as an upper bottom edge, a support or a substrate serves as a lower bottom edge, the box dam serves as a side edge, and therefore a heat conducting cavity is formed in the rim of the LED chip; by arranging the solid transmitting heat conducting window layer and constructing a heat guide cavity structure, a good heat dissipating channel is formed in the rim of the LED chip, comprehensive heat resistance is reduced, heat in the center of the LED chip can be guided out easily, the light exit rate is increased, and the service life of the low-color-temperature LED luminescent device can be prolonged greatly. The total reflection angle can be reduced, the light exit rate is increased, and the problems that an original packaging mode is low in light exit rate, and the color temperature drifts are solved. The packaging method and structure can be widely applied to the field of packaging of the LED chip and the luminescent devices.
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Description

technical field

[0001] The invention belongs to the field of semiconductor devices, in particular to a packaging method and packaging structure for high-power LEDs. Background technique

[0002] Traditional LED packaging structures such as figure 1 As shown, the surface of the LED chip 2 is protected by a silica gel coating layer 4 to protect the LED chip and the gold wire 5, and the LED chip is fixed in the bracket 1 through the crystal-bonding glue 3. This structure is called "formal installation" in the industry. structure.

[0003] The publication date is March 25, 2015. In the Chinese invention patent application with the publication number CN 104465966 A, a "white light LED packaging structure and packaging method thereof" is disclosed. The packaging structure includes a bracket 1, at least one LED flip-chip Chip 2-1, a fluorescent powder film 6, and a transparent silica gel coating layer 4, wherein the LED flip chip is arranged in the LED bracket, the positive pole ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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