Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-layer module interconnection integrated cabinet for electronic equipment

A technology of electronic equipment and multi-layer modules, which is applied to the structural parts of electrical equipment, electrical components, circuit layout on the support structure, etc., can solve the problems of narrow cabin space, complex cabinet structure, and large number of wires, etc. It achieves the effects of convenient installation and maintenance, stable and reliable geometric structure, improvement of internal space utilization and maintenance efficiency

Pending Publication Date: 2022-06-03
10TH RES INST OF CETC
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the deficiencies of the existing technology in view of the specific situation of narrow cabin space, complex cabinet structure and large number of wires in the equipment system, to provide a convenient installation and maintenance, which can improve the internal space of the cabinet. Utilization, can be rotated to achieve two-way plug-in modules, comprehensive integrated heat dissipation and multi-layer module interconnection Simple storage rack structure, to meet the requirements of convenient installation, use and maintenance of storage racks in light and small cabinet equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-layer module interconnection integrated cabinet for electronic equipment
  • Multi-layer module interconnection integrated cabinet for electronic equipment
  • Multi-layer module interconnection integrated cabinet for electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] see Figure 1-Figure 5. In the following embodiments, a multi-layer module interconnection integrated cabinet for electronic equipment includes: a left side panel 12, a right side panel 11, a rear beam 3, a middle beam 4, a beam 5, a front beam 6, installation accessories and each The multi-layer interconnected rotating storage rack and integrated heat dissipation mechanism composed of the layer fan assemblies 15, the cabinet cabinet 20 carrying the internal storage racks and cables of the electronic equipment, wherein: the middle and bottom of the rotating storage rack are provided with at least two layers of fan assemblies 15, the same The front and rear plug-in modules of each layer are connected to the same printed board 9 through connectors to realize interconnection, and the sockets of printed board 9 connect cables to realize external connection. Or converge upwards to the top cable tie frame 2. After the top cable tie frame 2 is assembled, it is bundled to the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

According to the multi-layer module interconnection integrated cabinet for the electronic equipment, the internal space utilization rate of the cabinet can be improved, and bidirectional module plugging, comprehensive integrated heat dissipation and multi-layer module interconnection can be achieved through rotation. According to the technical scheme, at least two layers of fan assemblies are arranged in the middle and at the bottom of a rotary storage rack, front and back insertion modules on the same layer are mutually inserted into the same printed board through connectors to achieve interconnection, and external connection cables and fan assemblies on all layers are interconnected through the back of the storage rack and line routing or are gathered upwards to a top wire binding rack; the bottom integrated fan assembly and the middle integrated fan assembly extract air upwards through a left side plate and a right side plate to form upper and lower air channels of the storage rack, and each layer of bidirectional plugging modules are fixed together with a rear cross beam, a middle cross beam, a front cross beam, a front guide rail assembly and a rear guide rail assembly through the air channels, so that a module comprehensive integrated heat dissipation system is formed; and the rotary storage rack rotates the rear plug-in module to the front end, so that bidirectional plugging of the front plug-in module and the rear plug-in module is completed through rotation in the same direction.

Description

technical field [0001] The invention relates to the technical field of integrated storage racks for cabinet-type electronic equipment, in particular to a multi-layer module interconnection integrated cabinet suitable for electronic equipment with easy installation, use and maintenance requirements, comprehensive integrated heat dissipation requirements and simple multi-layer module interconnection requirements. Background technique [0002] With the rapid development of modern electronic information technology, modern electronic equipment is developing towards light and miniaturization, and the volume of electronic equipment is gradually shrinking. More and more are used for the integration of all or part of multi-functional ground electronic equipment such as communication, measurement and control The degree is getting higher and higher, and there are higher requirements for the comprehensive heat dissipation design and maintainability design of the equipment. The storage r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/14H05K7/20H05K7/10
CPCH05K7/14H05K7/1447H05K7/20136H05K7/20172H05K7/20145H05K7/10
Inventor 林修文
Owner 10TH RES INST OF CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products