Method and device for panel etching process

Abstract

The faceplate to be etched is immersed in the etching solution. In etching procedure, the faceplate makes reciprocating type displacement in up / down or left / right along direction parallel to the faceplate to let etching solution contact surface of faceplate evenly so as to obtain even etching effect. Moreover, relative motion between the faceplate and etching solution makes etched out art are separated from surface rapidly so as to reach purpose of raising etching effect.

Description

field of invention [0001] The present invention relates to a panel etching process method and its device, in particular to a method and device capable of improving etching uniformity and increasing etching efficiency in the etching process. Background technique [0002] According to the wet etching technology, the chemical reaction between the film and a specific solution is used to remove the film on the substrate, so as to form the desired pattern on the substrate or to make the substrate thinner. The advantage of this technology is that the process is simple. , simple equipment, low cost and fast processing efficiency. However, as we all know, etching uses chemical reactions to remove or thin films, and the chemical reactions themselves are not directional, so this isotropic etching feature makes it difficult to precisely control the etching at local locations As a result; in addition, due to the influence of the viscosity of the etching solution itself, this etching met...

AI Technical Summary

Problems solved by technology

However, as we all know, etching uses chemical reactions to remove or thin films, and the chemical reactions themselves are not directional, so this isotropic etching feature makes it difficult to precisely control the etching at local locations As a result; in addition, due to the influence of the viscosity of the etching solution itself, this etching method is difficult to etch the entire surface uniformly, resulting in incomplete etching in some areas, and undercutting in other areas. Seriously affect the product yield; however, as the size of the product components becomes smaller and the processing precision becomes higher and higher, the uniformity of the etching process becomes more important

[0003] In addition, under the trend of consumer electronics products becoming thinner, lighter and smaller in recent years, the display panel, which is the basic component of such products, is also required to meet the requirements of thinness and thinness. Its glass substrate implements a thinning process to achieve the goal; among the many known thinning process technologies, the etching method is the most commonly used, mainly because the etching thinning process usually has excellent processing efficiency, and the process However, as mentioned in the previous paragraph, the lack of etching process will also lead to many bad results, such as: uneven etching leads to different thickness of each part of the glass plate (especially for large areas) When the glass substrate is used), the mechanical strength of the glass plate will be sharply reduced and it will be easily damaged, and the uneven etching will also cause surface roughness, which will affect the image quality of the liquid crystal display component.

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