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Metallic ball detection sensor and its manufacturing method

A technology for detecting sensors and metal balls, applied in instruments, measuring devices, measuring magnetic variables, etc., can solve problems such as difficulty in reducing the size, adverse effects of peripheral circuits, and limited thinning of through-type proximity sensors

Inactive Publication Date: 2007-11-14
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This through-type proximity sensor detects disturbances in the magnetic field by coil windings wound on the outer peripheral surface of the through-hole, but in this case also, the case covering the wiring board must be placed up and down, and the coil needs to be covered up and down as a countermeasure against static electricity. There is a pair of upper and lower shield rings on the outer circumference of the winding, so it is difficult to shorten the dimension in the vertical direction, and there is a limit to reducing the thickness of the through-type proximity sensor
[0011] In addition, in the above-mentioned two patent documents, by using the linear winding to guide the static electricity absorbed from the charged ball or the like to other positions separated from it to discharge, the coil winding is protected from static electricity damage, but due to the static electricity of the discharge It will cause adverse effects on peripheral circuits or various components, so it is desired to be improved

Method used

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  • Metallic ball detection sensor and its manufacturing method
  • Metallic ball detection sensor and its manufacturing method
  • Metallic ball detection sensor and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0054] Accompanying drawing shows the metal ball detection sensor that is assembled in the pinball machine and detects the situation that ball passes through, and Fig. 1 is the perspective view of metal ball detection sensor 11 backsides, and Fig. 2 is the use state that shows socket 12 is connected on the metal ball detection sensor 11 3 is an exploded perspective view of the back side of the metal ball detection sensor 11 viewed obliquely from above, and FIG. 4 is an exploded perspective view of the back side of the metal ball detection sensor 11 viewed obliquely below.

[0055] In the following embodiments, when described in the use state, the shield cover or the component mounting surface side becomes the lower side so that the mounted components cannot be seen, so the lower side will be described as the upper side. The metal ball detection sensor 11 is preferably used with a shield or an electronic component mounting surface as a lower surface, so that the shield is less l...

no. 2 example

[0100] Compared with the metal ball detection sensor 11 of the first embodiment, the metal ball detection sensor 141 differs only in that: the shielding cover 142 covering the entire body 18 is used; and the insulating resin material 19 is only used on the coil winding 20 side, On the wiring board 15 side, the insulating resin material 19 is not used, and the other structures are the same, and the same reference numerals are assigned to the same structures, and description thereof will be omitted.

[0101] Fig. 14 is an external perspective view of the back side of the metal ball detection sensor 141, Fig. 15 is an exploded perspective view of the back side of the metal ball detection sensor 141 viewed from obliquely above, and Fig. 16 is an exploded perspective view of the back side of the metal ball detection sensor 141 viewed from obliquely below exploded perspective view.

[0102] In the following embodiments, when described in a state of use, the shield cover or the compo...

no. 3 example

[0106] Compared with the metal ball detection sensor 11 of the first embodiment, this metal ball detection sensor 171 is only different in that: the upper cover 172 is used; and the insulating resin material 19 is used only on the coil winding 20 side, The insulating resin material 19 is not used on the 15 side, and the other structures are the same, and the same reference numerals are assigned to the same structures, and description thereof will be omitted.

[0107] Fig. 17 is an appearance perspective view of the back side of the metal ball detection sensor 171, Fig. 18 is an exploded perspective view of the back side of the metal ball detection sensor 171 observed from obliquely above, and Fig. 19 is an exploded perspective view of the back side of the metal ball detection sensor 171 observed from obliquely below exploded perspective view.

[0108] In the following embodiments, when described in a state of use, the shield cover or the component mounting surface side becomes...

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PUM

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Abstract

To provide a highly reliable detection structure making it easy to take electric discharge measures in addition to the thinning of a sensor structure, not by building an antistatic shield member into the interior, but by providing a conductive member doubling as a case on the outer circumference, as antistatic measures for protecting an internal coil winding from external static electricity, as to a metallic ball detection sensor for detecting a metallic ball by causing it to pass therethrough. This metallic ball detection sensor includes a coil spool made by winding a coil winding on the outer circumference of a through hole for causing a conductive ball to pass therethrough, a wiring board mounted with a sensor circuit made by connecting both ends of the coil winding wound on the coil spool, and the base for mounting thereon the coil spool and the wiring board in a manner in which they are separated from each other on one side and on the other side. This detection sensor is made by covering the conductive member, as an external shell member, at least, on either the ball infall side or the ball run out side on the periphery of the through hole.

Description

technical field [0001] The present invention relates to a metal ball detection sensor built in, for example, a pinball machine installed in a game hall, and more specifically, to a metal ball detection sensor and a metal ball detection sensor capable of reducing the thickness of the sensor structure for detecting whether a metal ball passes. manufacturing method. Background technique [0002] Hereinafter, a case where the metal ball detection sensor is used in a pinball machine will be described. [0003] Generally, in a pinball machine, when a game metal ball (hereinafter referred to as a ball) is obtained from a prize slot provided on the game board, or when the ball passes through the dispensing path, the passage of the ball is detected by a through-type metal ball detection device. . [0004] Such a metal ball detection sensor is assembled into various units such as the winning slot unit for managing the passage of balls, and detects and confirms the passage of balls i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R33/09H01H36/00
Inventor 畠田光男一色信贤味冈勉山口耕一竹谷宏昭
Owner ORMON CORP
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