System-level packaging module and its preparing method
A system-in-package and manufacturing technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as time-consuming and labor-intensive inspection operations, affecting product yield, and welding pads 7 together.
Inactive Publication Date: 2007-11-14
UNIVERSAL SCI IND CO LTD
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Problems solved by technology
[0003] Since the multilayer circuit board 2 may be warped due to thermal expansion and contraction, some solder pads 7 cannot be welded together with the main circuit board 91, which affects the yield of the product, and because the solder pads 7 are located on the bottom surface of the bottom circuit board 6 Therefore, it is difficult for quality control personnel to check whether the solder is well welded to the pad by the appearance, and the quality of the product must be detected through electrical testing, which is time-consuming and labor-intensive.
Method used
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[0047] 4-6, the system-in-package module 10 provided by the first preferred embodiment of the present invention includes a first circuit board 20, two second circuit boards 30, and a third circuit board 40 from top to bottom. Fold together to form a combined body 50.
[0048] The top surface of the first circuit board 20 is provided with a plurality of electronic components 22, and a plurality of circuits 24 are connected to the electronic components 22; the two second circuit boards 30 are respectively provided with a plurality of solder pads 32 on the top surface of the first circuit board. The peripheries of the two circuit boards 30 and a number of lines 34 are connected to the solder pads 32, wherein the peripheries of the solder pads 32 are aligned with the peripheries of the second circuit board 30; the bottom surface of the third circuit board 40 is provided with a number of solder pads 42 is located on the periphery of the third circuit board 40 and corresponds to the pos...
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The invention is a system-level packaging module, comprising a first circuit board, at least a second circuit board and a third circuit, stacked together from the top down to form a combined body, where the top surface of the first circuit board is equipped with at least an electronic component and several connections; the top surface of the second circuit board is equipped with several pads located on the edge and several connections, and the bottom surface of the third circuit board is equipped with several pads located on the edge and several connections, and the combined body has several plated through holes connected with the connections on the first, second and third circuit boards to make the electronic component of the first circuit board connected with the pads on the second and third circuit boards, and thus, the system-level packaging module is easy to weld and detect.
Description
Technical field [0001] The invention relates to a circuit board, and particularly refers to a system-level packaging module, which is easy to be soldered and inspected. Background technique [0002] As shown in Figure 1 and Figure 2, the known system-in-package module 1 is formed by pressing a multilayer circuit board 2. The top surface of the top circuit board 3 is provided with a number of electronic components 4 such as ICs, and a number of circuits 5 with the When the electronic components 4 are connected, the bottom surface of the bottom circuit board 6 is provided with a number of solder pads 7, and a number of circuits 8 are connected to the solder pads 7, and the circuit 5 of the top circuit board 3 consists of a number of plated through holes 9 and the bottom circuit board Line 8 of 6 is electrically connected. The system-in-package module 1 can be welded together with a main circuit board 91 using solder pads 7 as shown in FIG. 3. [0003] Since the multilayer circuit b...
Claims
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IPC IPC(8): H01L25/00H01L23/488H01L21/60
CPCH01L24/97
Inventor 颜启仁
Owner UNIVERSAL SCI IND CO LTD