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Light-emitting device

一种发光装置、发光元件的技术，应用在照明装置、电致发光光源、光源等方向，能够解决不能防止模制合成树脂脱落等问题，达到不易脱落的效果

Inactive Publication Date: 2008-01-16
NEC LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the invention disclosed in JP-A No. 2004-111937 cannot prevent the peeling of the molded synthetic resin at the corner of the installation space caused by the fact that when the installation surface is rectangular shape, and the electrode pads are formed as wide as possible on the mounting surface resulting in

Method used

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Embodiment Construction

[0018] A light emitting device according to an embodiment of the present invention will be described below with reference to FIGS. 1A to 1C .

[0019] As shown in FIGS. 1A to 1C , a light emitting device according to an embodiment of the present invention includes three light emitting elements, namely a light emitting element R, a light emitting element G and a light emitting element B, which are installed in the installation space 2 of the ceramic package 1 . The light emitting element R emits red light, the light emitting element G emits green light, and the light emitting element B emits blue light. Therefore, the light emitting device according to the present embodiment can emit white light through additive color mixing.

[0020] Ceramic package 1 comprises a rectangular (square in the illustrative embodiment) bottom surface 3 and sidewalls 4 upstanding from each side of bottom surface 3 , or extending vertically upward. The light emitting elements R, G, B are arranged in...

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Abstract

A light-emitting device includes a ceramic package including a mounting space defined by a rectangular mounting surface and side walls erected from respective sides of the mounting surface, an electrode pad disposed on the mounting surface, a light-emitting element disposed on the electrode pad, and a molded synthetic resin filling the mounting space. The mounting surface includes corners that are not covered with said electrode pad so that a ceramic base of said ceramic package is exposed at said corners.

Description

[0001] This application is based on and claims priority from Japanese Patent Application No. 2006-189493 filed on July 10, 2006, the entire disclosure of which is incorporated herein by reference. technical field [0002] The present invention relates to a light emitting device including a light emitting element mounted in a ceramic package. Background technique [0003] There is known a light emitting device comprising a light emitting element (also referred to as "LED chip") mounted in a package. The package is made of synthetic resin or ceramics. Ceramics have the advantage that they have lower thermal resistance than synthetic resins and can effectively dissipate heat from LED chips. [0004] A light emitting device employing a ceramic package generally has a structure in which an LED chip provided in a mounting space in the ceramic package is housed in a molded synthetic resin. In order to install as large as possible LED chips in ceramic packages, or to install as ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/04H01L33/00H01L33/50H01L33/56H01L33/62
CPCH01L25/0753H01L33/486H01L2224/48091H01L33/52H01L2924/00014
Inventor 冲村克行
Owner NEC LIGHTING