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Method monitoring termination detecting state

A technology of endpoint detection and status, which is applied in the control of workpiece feed movement, grinding machine parts, semiconductor/solid-state device manufacturing, etc., can solve the problems of product grinding, unsafe production line, and no one is very good, so as to reduce the Cost, the effect of ensuring product safety

Inactive Publication Date: 2008-01-23
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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AI Technical Summary

Problems solved by technology

[0007] However, there is no good way to detect the status of the endpoint detection method itself
When the end point detection itself fails due to various reasons (such as water in the detection window, etc.), the grinding end point cannot be detected correctly
This is very unsafe for the production line, and it is easy to cause the product to grind to the maximum time set by the program, the product yield rate will decrease, and if it is serious, the product will be scrapped

Method used

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Embodiment Construction

[0017] In the current semiconductor production process, it is very important to ensure that the endpoint detection system is in a normal state.

[0018] The present invention pre-generates a light sheet with the same structure as the product to be produced as a test piece, and uses the same end point detection program as the product to detect the end point of the light sheet before producing a grinding process product that requires end point detection. The slice has no pattern, so it is easier to reflect the intensity of the detected optical signal change. So as to achieve the purpose of monitoring whether the endpoint detection is in a normal state.

[0019] The flow chart shown in FIG. 1 specifically describes how to implement the process of monitoring whether the end point detection of chemical mechanical polishing is normal or not by using the method of the present invention.

[0020] When a batch of products arrives and needs to be ground, first check whether the speed o...

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Abstract

The invention discloses a monitoring method of destination test situation, which adopts pre-generated polished section with same structure of products as testing plate. Before producing milling product needing terminal testing, adopts the terminal testing procedure to test the terminal of testing plate, thus achieving monitoring the terminal test is or not under the normal situation. The invention can test the milling terminal accurately and ensure the qualification rate of product. The invention not only can be used as the terminal test method using optics theory, but also can be used for monitoring terminal test method by temperature changes and current intensity.

Description

technical field [0001] The invention relates to a detection method in a semiconductor manufacturing process, in particular to a monitoring method for an end point detection state in a chemical mechanical polishing process. Background technique [0002] In the semiconductor manufacturing process, the end point detection of the chemical mechanical polishing process has the characteristics of process stability, because after grinding to a new medium, the end point detection can be realized according to the end point detection program, so it is not affected by the change of the previous film; it is beneficial to the system program maintenance. [0003] At present, endpoint detection methods are used in shallow trench isolation (STI) process, tungsten polishing (W-PLUG) process and copper polishing (Cu-CMP) process. [0004] For example, the manufacturing process of shallow trench isolation, chemical mechanical polishing (CMP) is commonly used to remove and planarize the overfil...

Claims

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Application Information

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IPC IPC(8): B24B49/00H01L21/304
Inventor 王海军王贝易程晓华赵正元
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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