Combined structure of image sensing wafer and glass substrates and manufacturing method therefor

Abstract

The invention relates to a combining structure of an image sensor wafer and a glass base plate with the related processing method, and is characterized in that the combining structure of the image sensor wafer and the glass base plate is provided with a plurality of metal convex blocks and a metal convex ring on an active surface of the image sensor wafer, the metal convex ring is a light sensing area cycling the image sensor wafer and separates the light sensing area from the metal convex block, a line layer of the glass base plate comprises a plurality of connecting pads and a metal ring. When the image sensor wafer and the glass base plate are mutually pressed together, the metal convex block is connected with the connecting pads while the metal convex ring is connected with the metal ring in order to form a gas-closed and sealed light sensing area which can prevent the sealing glue from polluting the sensing area and effectively protect sensing elements in the light sensing area and avoid deterioration of sensing sensitivity, therefore is very practical.

Description

technical field [0001] The present invention relates to a combination technology of an image sensing chip, in particular to an air-tight and sealed light sensing area to prevent the sealant from polluting the light sensing area, effectively protect the sensing elements in the light sensing area, and can Combination structure of image sensing chip and glass substrate for avoiding deterioration of sensing sensitivity and manufacturing method thereof. Background technique [0002] The bonding structure of the image sensing chip and the substrate is to complete the electrical connection between the substrate and the image sensing chip by wire bonding or flip-chip bonding. In recent years, the sensor packaging structure has been changed to Chip On Glass (Chip On Glass, COG) package, the flip-chip chip can be directly bonded to a glass substrate, and at the same time, the step of wiring is exempted, which meets the current requirements of light, thin, short, and small semiconducto...

AI Technical Summary

Problems solved by technology

Usually, the sealant 130 must be heated and baked to achieve curing. When the sealant 130 is baked, the sealant 130 will emit toxic or irritating volatile gases, or the sealant 130 is easy to be dislodged during the dispensing process. The capillary phenomenon overflows to the photo-sensing region, polluting the photo-sensing region 112 of the image sensing chip 110, causing the sensing elements in the photo-sensing region 112 to malfunction or degrade the sensing sensitivity

[0004] It can be seen that the above-mentioned existing combined structure of the image sensing chip and the glass substrate and its manufacturing method obviously still have inconveniences and defects in terms of product structure, manufacturing method and use, and need to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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