Apparatus and methods of cleaning substrates

Abstract

The invention relates to a wafer cleaning method and an apparatus used in said method. The apparatus comprises an enclosure; a stage within the enclosure; at least one first wall around the stage within the enclosure; a plate within the enclosure and above the stage, operable to enclose a first region between the stage and the first wall; and an exhauster part coupled to the first region between the stage and the first wall. The method for cleaning a wafer includes: putting the stage with a wafer into a closed vessel which is arranged in the enclosure; spraying a first chemical onto the surface of a substrate with a first nozzle; spraying a second chemical onto the surface of the substrate with a second nozzle to avoid the products generated by chemical reaction between the first and the second chemical in the first and the second nozzle. The invention is suitable for practicality since an airtight space therein is arranged between a cleaning enclosure and a cleaning stage to avoid short circuit or opening of the integrated circuit on the wafer by means of preventing liquid ammonium sulfate residue from crystallizing when cleaning the wafer.

Description

technical field [0001] The present invention relates to a device for forming a semiconductor structure and a manufacturing method thereof, in particular to a device capable of preventing liquid ammonium sulfate residual crystals in the wafer cleaning process from causing short circuit or generation of integrated circuits located on the wafer. Open wafer cleaning apparatus and method thereof. Background technique [0002] With the development of electronic products, semiconductor technology has been widely used to manufacture memories, central processing units, liquid crystal displays, light-emitting diodes, laser diodes, and components or chipsets. In order to achieve the goal of high integration and high speed, the feature size of semiconductor integrated circuits is still shrinking continuously. At present, many materials and technologies have been developed to achieve the above-mentioned goals of integration and speed, and to overcome the following problems. The ensuing ...

AI Technical Summary

Problems solved by technology

The crystallization of the ammonium sulfate residue 180 falling on the wafer 150 may cause a short circuit or an opening in the integrated circuit located on the wafer 150

[0007] This shows that the above-mentioned existing equipment for cleaning substrates and methods thereof obviously still have inconvenience and defects in product structure, method and use, and need to be further improved urgently

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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