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Drawings device and drawing method

A technique for drawing areas and marking positions, which is applied to photolithographic process exposure devices, exposure methods of radiation-sensitive masks, and printed circuit manufacturing. Effect

Inactive Publication Date: 2008-03-05
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This has the problem that there are restrictions on the arrangement, number and shape of the standard markers and the shape of the drawing area

Method used

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  • Drawings device and drawing method
  • Drawings device and drawing method
  • Drawings device and drawing method

Examples

Experimental program
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Embodiment Construction

[0036] Hereinafter, an exposure apparatus using an exemplary embodiment of the drawing method and apparatus according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a schematic structure of the present exposure apparatus. The present exposure device is a device that exposes images of a plurality of wiring patterns and the like on a single substrate, and exposes the wiring patterns of each layer in a multilayer substrate such as a multilayer printed circuit board. It is to be mentioned that this embodiment can also be used for single layer substrates. In addition, the substrate may be various structures such as filters for display devices or semiconductors and the like. First, the schematic structure of the present exposure apparatus will be described.

[0037] As shown in FIG. 1 , the present exposure apparatus 10 is provided with a plate-shaped moving platform 14 , and a substrate 12 is sucked and...

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Abstract

A drawing device, comprising: a setting portion that sets: standard mark position data relating to positions of a plurality of standard marks provided on a drawing medium at which a plurality of images are drawn at respective predetermined drawing regions; drawing position data relating to positions of a plurality of drawing regions; and standard mark correspondence data showing a corresponding relation between the positions of the plurality of standard marks and the plurality of drawing regions; a detecting portion that detects the positions of the plurality of standard marks and obtains the detected position data; a correcting portion that corrects drawing positions of the plurality of drawing regions based on the standard mark position data, the drawing position data, the standard mark correspondence data, and the detected position data; and a drawing portion that draws the plurality of images at the corrected drawing positions on the drawing medium, is provided.

Description

technical field [0001] The present invention relates to a drawing device and a drawing method, and in particular to a drawing device and method for arranging an image at a predetermined position of an object to be drawn and then performing drawing. Background technique [0002] Conventionally, as an apparatus for drawing a predetermined wiring pattern on a substrate of a printed circuit board, various exposure apparatuses using photolithography techniques have been proposed. [0003] An example of such a proposed exposure device is a device that scans a light beam on a substrate coated with a photoresist in the main scanning direction and the sub scanning direction, and modulates the The light beam forms a wiring pattern. [0004] Here, there is a tendency that the definition of a wiring pattern of a printed circuit board formed by an exposure apparatus such as the one described above becomes higher and higher. For example, in the case of forming a multilayer printed circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H04N1/04H05K3/00
CPCG03F9/7088G03F7/2057H05K1/0269H05K3/0008H05K2201/09918G03F9/00H05K3/0097H05K3/0082G03F7/70291H05K13/06
Inventor 平岛卓哉
Owner FUJIFILM CORP