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Lead-free solder

A lead-free solder and raw material technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of increasing solder cost, high melting point, and rising price, and achieve price reduction, low melting point, and low cost Effect

Inactive Publication Date: 2008-03-12
深圳市弘星威焊锡制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In February 2003, the European Union promulgated the two directives "WEEE" and "ROHS", and the "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" required that electrical and electronic products entering the EU market after July 1, 2006 must not contain lead and mercury , cadmium, chromium, polybrominated diphenyl ether and polybrominated biphenyls, and the traditional tin-lead solder has good soldering performance and low price, but lead is a prohibited harmful substance, so it is necessary for maintenance And to expand the export of my country's electronic products to the EU, domestic research and development of lead-free solder has been extensively researched, and foreign countries have started and invested heavily in research on lead-free solder since 1999. In 2005, most countries realized lead-free electronic products. Therefore, the production of high-performance and environmentally friendly lead-free solders can meet the urgent requirements of the electronics industry. At present, the lead-free solders widely studied are mainly SnAg, SnCu, SnBi, SnZn and SnAgCu. The prices of these raw materials are increasing year by year, which increases the cost of solder, and Some have a high melting point

Method used

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Embodiment

[0012] Example

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Abstract

The present invention relates to a lead-free solder which is characterized in that the lead-free solder consists of materials with the following weight percentage: Ag from 0.1percent to 0.5percent, Sb from 3.0 percent to 5.0percent, Bi from 1.0percent to 4.5percent, P from 0.001percent to 0.01percent and Sn as the rest. The present solder has advantages and effects of a low cost and a low melting point.

Description

technical field [0001] The invention relates to a lead-free solder, which belongs to soldering materials. Background technique [0002] In February 2003, the European Union promulgated the two directives "WEEE" and "ROHS", and the "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" required that electrical and electronic products entering the EU market after July 1, 2006 must not contain lead and mercury , cadmium, chromium, polybrominated diphenyl ether and polybrominated biphenyls, and the traditional tin-lead solder has good soldering performance and low price, but lead is a prohibited harmful substance, so it is necessary for maintenance And to expand the export of my country's electronic products to the EU, domestic research and development of lead-free solder has been extensively researched, and foreign countries have started and invested heavily in research on lead-free solder since 1999. In 2005, most countries reali...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 连增雄连泽铭连泽成
Owner 深圳市弘星威焊锡制品有限公司