Hollow heat-insulation building block and method of producing the same

Abstract

The present invention discloses a novel hollow insulation building block and the preparation method. The hollow insulation building block of the present invention is mainly made of raw materials with following portion: 0.5 to 1.5 portion of acidification magnesium insulation materials and 1 to 3 portion of expanded perlite. The hollow insulation building block of the present invention has a preparation method comprising the following steps: 1) raw materials are fetched according to the weight portion: 0.5 to 1.5 portion of acidification magnesium insulation materials and 1 to 3 portion expanded perlite; 2) The raw materials are mixed well; then water of 30 to 40 percent of the total weight of the mixture is added; the hollow building block is prepared by compressing with use of the traditional brick-making process; no calcination or drying is needed. The hollow insulation building block prepared in the present invention is a burning-free product. After the slurry is dried, a crystalline grid can be formed; the minimum bearable pressure is 1.0MPa and the maximum bearable pressure is up to 2.0MPa; the thermal conductivity coefficient is between 0.08 / m question mark k and 0.1 / m question mark k, which is 8 times of the temperature-resistant capability of an ordinary brick. The present invention is energy-saving, insulative, thermal insulative, fireproof and capable of bearing pressure, and is a building insulation material of excellent performances.

Description

technical field [0001] The invention relates to a building material, in particular to a hollow thermal insulation block for building and a preparation method thereof, belonging to the field of building materials. Background technique [0002] At present, the thermal insulation materials using polystyrene board, dense polystyrene board and thermal insulation mortar (cement mixed with polystyrene particles) in the thermal insulation market all have their own insurmountable defects and unsatisfactory parts in technology. [0003] Polystyrene board is an organic material extracted from petroleum. Sensitive to the influence of temperature, the molecular activity is very active. The heat-resistant temperature is only 70°C, and the dimensional change rate reaches 5% after 48 hours at 70°C as measured by experiments. The outdoor temperature in Northeast China is -45°C to -20°C in winter, and the wall temperature in South China can reach a maximum of 70°C to 75°C in summer. The po...

AI Technical Summary

Problems solved by technology

Facing the specific implementation of this requirement and standard, the current thermal insulation exterior wall system, polystyrene board and compact board will face practical problems in technology and construction: the thermal conductivity of polystyrene board is 0.04w / m·k, The thermal conductivity of the dense board is 0.027-0.029w / m·k. Although the thermal conductivity of the dense board is good, its wind resistance value cannot withstand the high-rise buildings.

This will inevitably lead to the disadvantages of cumbersome construction, insufficient wind pressure resistance, and unsafe use on high-rise buildings.

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