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Printed wiring board

A technology of printed circuit boards and wiring substrates, which is applied in the fields of printed circuits, printed circuits, printed circuit manufacturing, etc., which can solve the problems of insulation resistance degradation of the insulating layer, increase of connection resistance, and easy accumulation of moisture, etc. The effect of reducing the speed deviation

Active Publication Date: 2008-05-14
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Such an underfill material is filled and solidified to produce a printed wiring board for mounting an IC chip. However, when there are cavities in the cured underfill material, moisture is easily accumulated in the cavity, and the printed wiring board is subjected to high temperature. In the HAST test in a humid environment, based on the void existing at the interface between the surface of the solder resist layer and the underfill material, or near the interface between the underfill material and the IC, it is easy to get between the solder mask layer and the underfill material, or Cracks between underfill material and IC
Therefore, there is a problem that the insulation resistance of the insulating layer composed of the solder resist layer and the underfill material deteriorates, and peeling occurs between the substrates, thereby increasing the connection resistance between the IC chip and the solder bump.
[0007] In addition, there is a problem that moisture enters from the cracked interface, the solder migrates from the solder bumps, and the solder bumps are short-circuited between each other.

Method used

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Examples

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Embodiment 1

[0111] Hereinafter, an example of the printed wiring board and its manufacturing method of the present invention will be described with reference to the drawings. First, a first embodiment of the printed wiring board of the present invention will be described with reference to FIGS. 7 and 8 .

[0112] 7 shows a cross section of printed wiring board 10 (package substrate) before IC chip 90 as an electronic component is mounted, and FIG. 8 shows a cross section of printed wiring board 10 with IC chip 90 mounted thereon. As shown in FIG. 8 , an IC chip 90 is mounted on the upper surface of the printed wiring board 10 , and a sub-board 94 is connected to the lower surface.

[0113] The printed wiring board 10 of this embodiment has a form in which built-up wiring layers 80A, 80B are respectively formed on the front surface and the back surface of the core substrate 30 . This built-up wiring layer 80A is composed of interlayer resin insulating layer 50 formed with interlayer via h...

Embodiment 2

[0182] The area of ​​the solder resist layer (electronic component mounting area) corresponding to the area (C4 area) where the conductor pad for IC chip mounting is provided is 70mm 2 , and the number of conductor pads provided in the mounting region was 2000 (the same as the number of electrodes of the IC chip), and a printed wiring board was produced in the same manner as in Example 1.

[0183] In addition, the surface in the electronic component mounting region in this example is formed as an uneven surface with a maximum roughness of 0.5 μm.

Embodiment 3

[0185] The area of ​​the solder resist layer (electronic component mounting area) corresponding to the area (C4 area) where the conductor pad for IC chip mounting is provided is 130mm 2 , and except that the number of conductor pads provided in the mounting area was 4000, a printed wiring board was produced in the same manner as in Example 1.

[0186] In addition, the surface in the electronic component mounting region in this example is formed as an uneven surface with a maximum roughness of 0.4 μm.

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Abstract

Disclosed is a printed wiring board wherein a solder resist layer is formed on the surface of a wiring board which is provided with a conductor circuit, a part of the conductor circuit exposed from an opening formed in the solder resist layer is formed into a conductor pad, a solder bump is formed on the conductor pad, an electronic component is mounted on the board via the solder bump, and the electronic component is sealed with an underfill resin. In this printed wiring board, the surface of the solder resist layer is planarized at least in the electronic component mounting region or the planarized surface is further subjected to a roughening treatment. Also disclosed is a method for manufacturing such a printed wiring board

Description

technical field [0001] The present invention relates to a printed wiring board such as a packaging substrate for mounting electronic components such as ICs, and more particularly to a surface structure of a solder resist layer that does not leave voids in underfill materials such as ICs sealed with resin. Background technique [0002] FIG. 11 shows a conventional printed wiring board constituting a package substrate. In this printed wiring board 210, a plurality of solder bumps 276 are formed on the substrate for mounting the IC chip 290 and the like on the substrate, and a solder resist layer 270 is provided so that these solder bumps 276 are not welded to each other. [0003] Specifically, a conductor circuit 258 including a solder pad 275 is formed on the substrate, a solder resist layer 270 is provided to cover the conductor circuit 258, an opening 271 is provided at a position corresponding to the solder pad of the solder resist layer 270, and After forming a nickel-pl...

Claims

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Application Information

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IPC IPC(8): H01L23/12H05K3/28
CPCH01L21/4846H01L24/81H01L2924/01088H01L2924/01047H01L2224/81192H01L2224/81815H01L2224/48227H01L2924/15311H01L2924/014H01L23/49827H01L2924/01029H01L2224/73204H01L2224/13099H01L2924/01051H01L2924/01018H01L2924/01084H01L2224/81801H01L24/11H01L2924/01079H01L23/49811H01L2924/01038H05K3/3452H01L2924/01006H05K3/381H01L2924/01019H01L2224/16225H01L2924/14H01L2224/85444H05K3/305H05K2201/10674H01L2924/01074H01L2924/0103H01L2924/01027H05K3/3436H01L2224/16H01L23/498H01L2924/15174H05K3/4602H01L2224/8121H01L2924/01013H01L2924/01005H01L2924/01033H01L2924/01082H05K2201/10977H01L2924/01046H01L2224/32225H01L2924/01015H01L24/16H05K2203/0278H01L21/563H01L2924/01078H01L2924/01011H01L2924/01058H01L2924/01023H01L2224/16237H01L2224/0554H01L2224/05568H01L2224/05573H01L2924/00014H01L2924/12042Y10T29/49117Y10T29/49128Y10T29/49144Y10T29/49155Y10T428/2804Y10T428/31511Y10T428/31681Y02P70/50H01L2924/00H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 川村洋一郎泽茂树丹野克彦田中宏德藤井直明
Owner IBIDEN CO LTD
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