Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator
A technology of piezoelectric oscillators and external terminals, applied in power oscillators, electrical components, impedance networks, etc., can solve problems such as lead frame deformation, inability to handle, and reduced strength
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Embodiment 1
[0054] figure 1 It is an exploded oblique view of the piezoelectric oscillator according to the first embodiment of the present invention. figure 2 for figure 1 A cross-sectional view of the piezo oscillator shown, image 3 for figure 1 A top view of the first package of the piezoelectric oscillator is shown.
[0055] The piezoelectric oscillator of the present invention has: a first package 2 in which a circuit element 1 constituting an oscillating circuit is accommodated; and a second package 4 in which a piezoelectric vibration element 3 is accommodated, and the second package 4 is stacked fixed on the first package body 2.
[0056] The first package body 2 has such as Figure 4 The shown lead frame 5 and transfer lead frame 6 are formed as follows.
[0057] First, an adhesive is applied to the surface of a base material (not shown) such as copper or stainless steel, and a conductive transfer lead frame 6 is placed on the coated surface, and the circuit element 1 is mo...
Embodiment 2
[0066] Figure 7 is a cross-sectional view of a piezoelectric oscillator according to a second embodiment of the present invention. In this embodiment, a structure is formed in which the leads 5 g having the external terminals 5 b of the lead frame 5 are extended and protruded to the outer shape of the first package body 2 . Specifically, after the first package 2 is molded by resin molding, the leads 5g are bent inwardly from the upper surface of the first package 2 so that the external terminals 5b are exposed on the upper surface of the first package 2 . In addition, depending on the size of the second package or the wiring pattern, the leads 5g may be bent outward along the upper surface of the first package 2 in some cases.
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