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Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator

A technology of piezoelectric oscillators and external terminals, applied in power oscillators, electrical components, impedance networks, etc., can solve problems such as lead frame deformation, inability to handle, and reduced strength

Active Publication Date: 2010-09-29
YOSHIKAWAIND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the thickness of the lead frame is reduced for miniaturization and thinning, the strength also decreases, causing deformation of the lead frame during handling during assembly, and in some cases, it cannot be handled.

Method used

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  • Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator
  • Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator
  • Piezoelectric oscillator, and communication device and electronic device provided with such piezoelectric oscillator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] figure 1 It is an exploded oblique view of the piezoelectric oscillator according to the first embodiment of the present invention. figure 2 for figure 1 A cross-sectional view of the piezo oscillator shown, image 3 for figure 1 A top view of the first package of the piezoelectric oscillator is shown.

[0055] The piezoelectric oscillator of the present invention has: a first package 2 in which a circuit element 1 constituting an oscillating circuit is accommodated; and a second package 4 in which a piezoelectric vibration element 3 is accommodated, and the second package 4 is stacked fixed on the first package body 2.

[0056] The first package body 2 has such as Figure 4 The shown lead frame 5 and transfer lead frame 6 are formed as follows.

[0057] First, an adhesive is applied to the surface of a base material (not shown) such as copper or stainless steel, and a conductive transfer lead frame 6 is placed on the coated surface, and the circuit element 1 is mo...

Embodiment 2

[0066] Figure 7 is a cross-sectional view of a piezoelectric oscillator according to a second embodiment of the present invention. In this embodiment, a structure is formed in which the leads 5 g having the external terminals 5 b of the lead frame 5 are extended and protruded to the outer shape of the first package body 2 . Specifically, after the first package 2 is molded by resin molding, the leads 5g are bent inwardly from the upper surface of the first package 2 so that the external terminals 5b are exposed on the upper surface of the first package 2 . In addition, depending on the size of the second package or the wiring pattern, the leads 5g may be bent outward along the upper surface of the first package 2 in some cases.

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PUM

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Abstract

A package structure for a piezoelectric oscillator for further size reduction and thinning of the piezoelectric oscillator. The piezoelectric oscillator is provided with a first package (2) wherein a circuit element (1) for constituting an oscillation circuit is stored, and a second package (4) which is fixed over the first package and has a piezoelectric oscillating element (3) stored inside. The first package (2) includes a lead frame (5) and a transfer lead frame (6), and some of the ends of the lead frame (5) are permitted to be external terminals (5b) exposed by facing the outer plane ofthe first package by being bent. The transfer lead frame (6) is so formed as to have the ends of a wiring pattern exposed by facing a peeling plane side of a molded resin as external terminals (6a), by arranging the wiring pattern on the base material during resin molding and peeling the base material after the resin molding.

Description

technical field [0001] The present invention relates to a piezoelectric oscillator used in communication equipment such as a mobile phone, electronic equipment, etc., and particularly relates to a package structure of the piezoelectric oscillator. Background technique [0002] Due to the rapid development of low price and miniaturization brought about by the popularization of mobile communication equipment such as mobile phones, there are also demands for miniaturization and thinning of piezoelectric oscillators such as quartz oscillators used in these communication equipment. improve. [0003] Conventionally, as a structure of a piezoelectric oscillator, as shown in Patent Document 1, a first package that accommodates circuit elements constituting an oscillation circuit, and a piezoelectric oscillator that is stacked and fixed on the first package and accommodates a piezoelectric oscillator inside are known. The second package of the electric vibrating element constitutes ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03B5/32
CPCH03H9/0547H03H9/1021
Inventor 帆足之彦山本光洋平野信治
Owner YOSHIKAWAIND CO LTD