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Method for measuring surface shape by using multi-wavelength and device for using the same method

A technology for measuring surfaces and measuring devices, which is applied to measuring devices, optical devices, instruments, etc., can solve problems such as time-consuming, failure to detect interference fringes, and inability to accurately find the edge of the surface to be measured, so as to improve work efficiency Effect

Inactive Publication Date: 2008-08-06
TOKYO INST OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, if the level difference state is unknown, it cannot be judged whether the level difference of the portion where the interference fringe shifts is convex or concave
Therefore, the edge portion of the steep part of the surface to be measured cannot be accurately obtained
[0006] In addition, if monochromatic light of different wavelengths is irradiated at different timings, each interference fringe cannot be detected, so it takes time to measure the surface height difference and shape of the measurement object

Method used

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  • Method for measuring surface shape by using multi-wavelength and device for using the same method
  • Method for measuring surface shape by using multi-wavelength and device for using the same method
  • Method for measuring surface shape by using multi-wavelength and device for using the same method

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Embodiment Construction

[0071] Embodiments of the present invention will be described below with reference to the drawings. In addition, in this embodiment, the measurement of the surface height and surface shape of a measurement object having a substantially flat surface shape using interference fringes will be described as an example.

[0072] FIG. 1 is a diagram showing a schematic configuration of a surface shape measuring device according to an embodiment of the present invention.

[0073] This surface shape measurement device is equipped with a monochromator that irradiates a specific wavelength region to a substantially flat measurement object 30 having unevenness on the surface such as a semiconductor wafer, a liquid crystal panel, a plasma display panel, a magnetic film, a glass substrate, or a metal film. An optical system unit 1 for light, a control system unit 2 for controlling the optical system unit 1 , and a holding table 40 for placing and holding a measurement object 30 .

[0074] T...

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Abstract

The present invention provides a method for measuring surface shape with multiple wavelengths and a device using the method. By arranging the reference surface in a posture inclined at an arbitrary angle with respect to the traveling direction of light, interference fringes are generated by the reflected light returning to the same optical path from the measurement target surface and the reference surface. At this time, the intensity value of each pixel of the interference fringes generated by each monochromatic light is captured by the imaging device using different multi-wavelength monochromatic lights. The CPU uses the expression for obtaining the interference fringe waveform, and uses the intensity value of each pixel and the intensity value of the adjacent pixel for each pixel to be calculated, assuming that the DC component, AC amplitude and phase of the interference fringe waveform contained in each pixel are equal. , the phase candidate value group of the interference fringe waveform of each pixel is obtained for each wavelength. Furthermore, a common surface height is obtained from the plurality of candidate value groups.

Description

technical field [0001] The present invention relates to a surface shape measurement method using multiple wavelengths for measuring semiconductor wafers, liquid crystal panels, and plasma display panels using a plurality of monochromatic lights with different wavelengths, and an apparatus using the method. , magnetic film, glass substrate, metal mold and other flatness of the measurement target object unevenness. Background technique [0002] Conventionally, the method of measuring the surface shape of the measurement target surface is performed as follows. The first monochromatic light and the second monochromatic light of different wavelengths are output at individual timings, and the beam splitter is used to irradiate each monochromatic light on the surface of the wafer as the measurement object and the reference mirror, so that it is reflected from both and returned. The reflected light converges to the beam splitter and passes through the same optical path to generate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00G01B11/24
CPCG01B9/02007G01B9/02032G01B11/2441G01B9/02009G01B9/02017G01B9/0203G01B11/303G01B11/306
Inventor 北川克一杉山将小川英光铃木一嘉
Owner TOKYO INST OF TECH