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Sheet application device and application method

A sheet sticking device and sheet technology, applied in the directions of adhesives, electrical components, circuits, etc., can solve the problem of not being able to enjoy the advantages of large size, and achieve the effect of improving processing capacity and reducing costs

Active Publication Date: 2010-04-07
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if the sticking device for processing large-diameter wafers is used as it is, the advantages of its large size cannot be enjoyed.

Method used

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  • Sheet application device and application method
  • Sheet application device and application method
  • Sheet application device and application method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Embodiments of the present invention will be described below with reference to the drawings.

[0041] figure 1 is a schematic front view showing the sheet sticking device according to this embodiment, figure 2 is a schematic perspective view thereof. In these figures, the sheet sticking device 10 includes: a sheet guide unit 12 disposed on the upper portion of a base 11; and a table 13 supporting a plurality of wafers W as plate-like members in approximately the same plane; The adhesive sheet S on the upper surface side of the wafer W imparts pressing force and sticks the adhesive sheet S to the pressure roller 14 of the wafer W; and after the adhesive sheet S is attached on the wafer W, A cutting device for cutting the adhesive sheet S at the outer edge; and a multi-joint manipulator 15 (hereinafter referred to simply as "manipulator 15"); While W is positioned, the camera 16 as the inspection mechanism of the inspection tool blade described later; and the storage ...

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PUM

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Abstract

A wafer (W) is supported on each inner table (52) of a table (13). After a band-like sheet (S) is paid out on to the upper surface side of the wafers (W), pressing force is applied to the sheet by a pressing roller (14). The adhesion sheet (S) is cut along wafer outer edges by a cutter blade (63) installed on the free end side of a robot (15). The robot (15) has a function of passing the cutter blade (63) to a suction arm (100) and conveying wafers (W) from a magazine (200) to the table (13) and a function of transferring wafers (W), to which the sheet has been applied, to a post process.

Description

technical field [0001] The present invention relates to a sheet sticking device and sticking method. More specifically, the present invention relates to a sheet that can be cut along the outer edge of each plate-shaped member while sticking the sheet to a plurality of plate-shaped members at approximately the same time. Pasting device and pasting method. Background technique [0002] Conventionally, on a semiconductor wafer (hereinafter simply referred to as "wafer"), a protective sheet for protecting the circuit surface is generally pasted, or a heat-sensitive adhesive sheet is pasted on the back or the surface thereof. [0003] There is known such a sheet sticking method (for example, refer to Patent Document 1): a raw material sheet (rolled paper) in which a tape-shaped adhesive sheet such as the above-mentioned protective sheet or adhesive sheet is temporarily stuck on a tape-shaped release sheet is used. ), after peeling the sheet from the release sheet and pasting it ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/52
CPCH01L21/67132Y10T156/1317Y10T156/1062Y10T156/12Y10T156/1052H01L21/683H01L21/52
Inventor 野中英明小林贤治
Owner LINTEC CORP