Method for measuring surface deformation under action of metal interconnection line force/electricity coupling

Abstract

The invention discloses a method for measuring surface deformation under the action of interconnected metal wire force and galvanic coupling and belongs to the technical field of deformation detection and optical measuring mechanics. The method for measuring surface deformation under the action of interconnected metal wire force and galvanic coupling produces gratings on an interconnected metal wire surface by using an ion beam lithography method or an electron beam lithography method, implements loading by a force / electricity coupled loading system, captures grating images before the loadingand in the loading process in real time by an optical microscope and an image collecting device, and obtains deformation information of the interconnected metal wire surface by a digital moire method, the wavelet transformation and the phase shift technique. The grating that is produced by the method for measuring surface deformation under the action of interconnected metal wire force and galvanic coupling has high quality and adjustable frequency shape, can exert multiple loads such as consistent stress / varying current, consistent current / varying stress, and consistent stress / consistent current fatigue, etc., on a test sample, has the advantages of real-time in-situ measurement, large measurement view, high sensitivity, no contact, simple operation, convenient data processing and high measurement precision, and has particular superiority in the research of the interconnected metal wire surface deformation.

Description

technical field [0001] The invention relates to a method for measuring surface deformation of metal interconnection wires under force / electrical coupling, and belongs to the technical fields of deformation detection and optical measurement mechanics. Background technique [0002] Today, with the development of VLSI and MEMS, the research on metal interconnection wires widely used in them is also deepening. These interconnection wires are often subjected to cyclic force / electricity / heat during micromachining preparation and use. and other multi-field coupling effects, the performance changes of metal interconnects under the action of external fields directly affect the service life and operational reliability of integrated circuits, micro-devices, and micro-equipment, and the performance changes of metal interconnects can usually be expressed through surface changes. Therefore, characterizing the surface deformation of metal interconnects under external field has become an ef...

AI Technical Summary

Problems solved by technology

The frequency of the grating produced by the mechanical scribing method is low and has high requirements for the movement accuracy of the scribing machine and the ambient temperature and humidity; the corrosion method, coating method, coating method, and replication method are difficult to apply to the special structure of the metal interconnection; AFM engraving The probe is easily damaged when scratching metal materials

Photolithography is divided into mask exposure method, optical interference method, and high-energy beam etching method. Among them, the mask exposure method has either low resolution or complex optical path and difficult mask preparation; The special structure of the line is difficult to accurately locate

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