Stirring type wet process machine and stirring type wet process

A wet process and machine technology, applied in printed circuit manufacturing, electrical components, liquid spray liquid treatment, etc., can solve the problem that the line width and spacing of circuit boards cannot meet the line width and spacing of high-density circuit boards, water stagnation, etc. , to achieve the effect of improving manufacturing precision, improving process precision, improving quality and efficiency

Inactive Publication Date: 2008-08-20
UNITED BENEFIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the current development and etching, there is a very serious "water stagnation" problem, which makes the line

Method used

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  • Stirring type wet process machine and stirring type wet process
  • Stirring type wet process machine and stirring type wet process
  • Stirring type wet process machine and stirring type wet process

Examples

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Embodiment Construction

[0022] The following will take the manufacturing process of the circuit board as an example to illustrate the concept of the present invention, but the present invention is not limited to the manufacturing process of the circuit board. In fact, due to the advancement and development of science and technology in recent years, the wet process has been applied to circuit boards from the early stage, and has spread to other industries. Now, whether it is semiconductor, liquid crystal display or plasma display panel production, it can See examples of successful wet process applications in these industries. Therefore, the present invention can also be applied to the above-mentioned industries to improve the process quality of these industries.

[0023] The manufacturing of circuit boards can be divided into three categories according to their manufacturing types: mechanical processing, wet process and image transfer. Among them, the wet process mainly refers to the process involvin...

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Abstract

The invention discloses an agitation type wet process machine station and an agitation type wet process, therein, the agitation type wet process machine station comprises a conveying system and a plurality of nozzles. The conveying system comprises a plurality of idler wheels, the idler wheels are located on upside and downside of said conveying system conveying path, the idler wheels between upside and downside are used for driving plate shape object to be processed. The idler wheel added with vane can agitate chemical agent. The nozzle is located on upside or downside of the conveying path for spraying or supplementing chemical agent to object that is to be processed.

Description

technical field [0001] The invention relates to a machine, in particular to an agitating wet process machine and an agitating wet process. Background technique [0002] In recent years, due to the rapid development of science and technology and the high demand of modern people for the portability of products, light, thin and small portable electronic products have become the mainstream in the current market. Because the size of electronic products has shrunk, the volume that can accommodate circuit boards in the products has also shrunk, making the design and development of circuit boards also begin to develop towards smaller and high-density circuit boards. [0003] The line width and spacing of the wires of the general circuit board are about 4-6mil. (1mil.=0.025mm), and the line width and spacing of the high-density circuit board are about 1mil. Because the line width and spacing of high-density circuit boards are narrower than those of ordinary circuit boards, the requi...

Claims

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Application Information

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IPC IPC(8): H05K3/02C23F1/08G03D5/04
Inventor 张世昌
Owner UNITED BENEFIT
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