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Design producing method of multi-layer printed circuit board

A technology of printed circuit boards and production methods, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of unsolved explosion boards, achieve the effect of reducing the probability of explosion, reducing the possibility, and simple and easy operation

Active Publication Date: 2008-08-27
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the slice analysis, the position of the cracked plate all occurred inside the outer prepreg, and most of them were above the buried holes under the copper foil with a large area, such as image 3 As shown, there is currently no solution to this problem

Method used

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  • Design producing method of multi-layer printed circuit board
  • Design producing method of multi-layer printed circuit board
  • Design producing method of multi-layer printed circuit board

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] From the perspective of PCB explosion, moisture absorption is the main reason for PCB delamination. Therefore, the present invention reduces the possibility of PCB board moisture absorption by optimizing the PCB design method and processing flow, thereby reducing the probability of copper foil explosion on the PCB surface. Specifically as follows,

[0027] In the PCB design link:

[0028] ①Using copper foil windows on large areas of copper foil to prevent copper foil from bursting, that is, when laying copper on a large area of ​​PCB surface, properly open some windows to provide a path for the moisture in the board to discharge;

[0029] ② Design heat dissipation ground holes on the large-area copper foil to prevent the surface copper foil from bursting, that is, design some heat dissipation through holes and blind holes, which can effectively increase the heat dissipation area and reduce thermal resistance, and set up conduction holes on the large-area copper foil , ...

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Abstract

The invention discloses a design production method of a multilayer printed circuit board. The method comprises the following steps: firstly, schematic diagram designing is performed to a printed circuit board; secondly, an inner layer circuit board is fabricated, and oxidation treatment is performed to the inner layer circuit board; thirdly, the inner layer circuit board is pressed into a multilayer printed circuit board with prepreg and copper foil after being baked through high temperature; fourthly, holes are drilled at the position of a multilayer circuit board which is required to perform interpenetrating and connection, and plated through hole operation is performed; fifthly, an electric circuit is etched on the outer layer substrate of the multilayer circuit board; sixthly, soldering resistant treatment is performed to the multilayer circuit board, and then high temperature baking is performed; seventhly, treatment is performed to the surface of the bonding pad of the multilayer circuit board, then appearance processing, electrical measurement and final-inspection are performed to the multilayer circuit board, and packaging is performed after the final-inspection is passed. The invention effectively reduces the probability for blistering of the copper foil on the PCB surface, has simple operation and is feasible, and is not require to increase the equipment invest.

Description

technical field [0001] The invention relates to the technical field of design and manufacture of a multilayer PCB (Printed Circuit Board, printed circuit board). Background technique [0002] Since July 2006, with the implementation of the ROHS directive (restriction on the use of certain hazardous substances in electrical appliances and electronic equipment), the use of lead, mercury, hexavalent chromium, cadmium, and PBB (polybrominated biphenyl) in electrical and electronic equipment is prohibited. , PBDE (polybrominated diphenyl ether) six substances. This requires that the lead-free process must be met during PCB processing and PCB soldering. PCB surface treatment should adopt lead-free process, and lead-free solder should be used in PCB soldering, resulting in the temperature of lead-free soldering being 30-40°C higher than before, so the sheets and solder resist inks used in PCB are reliable under high temperature. performance and solderability on lead-free surfaces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 高峰鸽
Owner ZTE CORP
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