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Glue solution injector driven by electromagnetic attraction

An electromagnetic suction and injector technology, which is applied in the direction of liquid injection devices, injection devices, electric solid devices, etc., can solve the problems that the injection needle is easily damaged, has not been improved well, and has no limit pin design, so as to reduce the strength requirement , expand the range of selection, improve the effect of service life

Inactive Publication Date: 2008-10-08
CENT SOUTH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There is a U.S. patent related to this, which proposes a design scheme of electromagnetic suction-driven injection distributor, which does not improve the shortcomings of traditional pneumatic injection distributors and still has the following disadvantages in its structure: First, due to the design As a whole, it is difficult to achieve a small gap between the electromagnet and the armature; second, there is no limit pin designed, and the spray needle directly collides with the base, making the spray needle easy to damage; third, there is no design preload adjustment knob, Can not adjust the movement stroke and spring preload

Method used

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  • Glue solution injector driven by electromagnetic attraction
  • Glue solution injector driven by electromagnetic attraction

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Embodiment Construction

[0021] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] See attached figure 1 , 2 , the present invention --- including nozzle 17, glue cavity 14, thermal control body 16, needle spring preloading device, electromagnet, stroke adjustment knob 1, is characterized in that: the needle spring preloading device includes spray Needle 17, spring 29, spring preloading device 4, connecting sleeve 11, iron 27; the center of the glue cavity 14 is a hollow glue storage hole, and one side is provided with a rubber inlet pipe 15 communicating with the glue storage hole, One end of the glue storage hole in the glue cavity is screwed with a nozzle 17 through a thermal control body 16, and the other end is connected to the lower end of the needle spring pretensioning device connection sleeve 11 through a nut 13; The connecting sleeve 11 of the tightening device is a hollow sleeve wit...

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Abstract

A glue ejector driven by electromagnetic suction includes a nozzle, a glue cavity, a thermal cavity, a spray needle spring pretightening device, an electric magnetic body and a stroke adjusting knob. One end of the glue cavity is rotationally provided with the nozzle through the thermal cavity and the other end is connected with the lower end of the spray needle spring pretightening device through a nut; the electromagnetic body is arranged inside a housing; the top part is rotationally provided with the stroke adjusting knob and arranged below the spray needle spring pretightening device. The present invention utilizes an electromagnetic force to realize a larger drive force and adopts a chock block to remove the collision between the spray needle and the nozzle so as to improve the service life of the spray needle and realize a small-sized spray needle, thereby reaching the goal of micro-amount glue spraying and large viscosity glue spraying. The glue ejector provided by the present invention has the advantages of simple structure, convenient use, adjustable spraying speed and glue spraying amount, long service life, being suitable for industrialization manufacture, being able to replace the existing spring- pneumatic drive glue spraying system and being suitable for the sealing and packaging of micro-electric chips in particular.

Description

technical field [0001] The invention discloses a glue spraying device, in particular to a glue injector driven by electromagnetic suction, relates to the technical field of microelectronic equipment, and is mainly applicable to microelectronic chip packaging. Background technique [0002] Glue jetting is a new type of microelectronic packaging technology. In the existing technical field, the glue spraying equipment used for microelectronic packaging is mainly based on the pneumatic glue spraying equipment of Asymtek Company. It controls the high-pressure air flow in and out through the air control valve to push the driver piston to move up and down, thereby pushing the injection needle to reciprocate, and realizes the injection process of extruding glue. The driving force provided by the existing pneumatically driven injector is small, and at the same time, because the needle directly collides with the base, the material and size of the needle are greatly limited, and the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B9/04H01L23/28
Inventor 邓圭玲王军泉谢敬华彭志勇
Owner CENT SOUTH UNIV
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