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Semi-conductor encapsulation structure having an antenna

A packaging structure and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, and record carriers used by machines, etc., can solve problems such as large antenna area, difficult to integrate packaging structure, and area limitations

Active Publication Date: 2008-10-15
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the area occupied by the antenna is generally larger, it is more difficult to integrate in the package structure
The usual practice is to form the antenna on the substrate in the package structure, however, since other components are placed on the substrate, the area available for forming the antenna is limited

Method used

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  • Semi-conductor encapsulation structure having an antenna
  • Semi-conductor encapsulation structure having an antenna
  • Semi-conductor encapsulation structure having an antenna

Examples

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Embodiment Construction

[0009] refer to figure 1 , shows a schematic cross-sectional view of the first embodiment of the semiconductor package structure with an antenna according to the present invention. The semiconductor package structure 1 includes a substrate 11 , a chip 12 , a sealing material 13 , an antenna 14 and several solder balls 15 . The substrate 11 has a first surface 111 and a second surface 112 . The chip 12 is located on the first surface 111 of the substrate 11 and is electrically connected to the substrate 11 . In this embodiment, the chip 12 has an active surface 121 , a back surface 122 , a circuit layer and at least one through silicon via (TSV) 124 . The circuit layer is located on the active surface 121 . The active surface 121 is flip-chip bonded to the first surface 111 of the substrate 11 . The TSV 124 is connected to the back surface 121 and the circuit layer.

[0010] The sealing material 13 covers a part of the chip 12 . In this embodiment, the sealing material 13...

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PUM

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Abstract

The invention relates to a semiconductor packaging structure with an antenna, which comprises a substrate, a chip, a sealing compound material and an antenna, wherein, the substrate is provided with a first surface and a second surface; the chip is positioned on the first surface of the substrate and electrically connected to the substrate; the sealing compound material completely or partially covers the chip; the antenna is positioned on the sealing compound material and electrically connected to the chip. As the area of the sealing compound material is very large, the needed antenna can be easily placed on the sealing compound material without occupying the area of the substrate.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure, in particular, to a semiconductor packaging structure in which an antenna is located on a sealing material. Background technique [0002] At present, in the wireless communication module, light, thin and small is a very obvious trend. Designers are trying their best to integrate more components into the same package structure. However, since the area occupied by the antenna is generally large, it is difficult to be integrated in the package structure. A common practice is to form the antenna on the substrate in the packaging structure. However, since other components are placed on the substrate, the area available for forming the antenna is limited. [0003] Therefore, it is necessary to provide an innovative and progressive semiconductor package structure with an antenna to solve the above problems. Contents of the invention [0004] The invention provides a semiconductor packag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L23/31H01L23/488G06K19/077
CPCH01L2924/15311H01L2224/48091H01L2224/73265H01L2224/32225
Inventor 邱基综李宝男
Owner ADVANCED SEMICON ENG INC