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Heat-exchange facility for thermoelectric application

A technology of heat exchangers and thermoelectrics, applied to machines using electric/magnetic effects, heat exchange equipment, thermoelectric devices that only use Peltier or Seebeck effects, etc., can solve problems such as unused thermoelectric systems

Inactive Publication Date: 2008-10-22
CARRIER CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metallic foams have recently been used in power electronics applications to dissipate heat; however, they have not been used in thermoelectric systems

Method used

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  • Heat-exchange facility for thermoelectric application
  • Heat-exchange facility for thermoelectric application
  • Heat-exchange facility for thermoelectric application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] 【0019】reference figure 1 , shows a thermoelectric system 10 with a thermoelectric element 15 . The thermoelectric element 15 consists of PN pairs or couplers 20 arranged electrically in series. Electrical connectors 25 provide connections between adjacent PN couplers 20 and to a power source (not shown). Substrates 30 and 35 are ceramic substrates that provide insulation for system 10 . Substrates 30 and 35 mechanically hold system 10 together and electrically insulate PN coupler 20 . The substrate 30 has a surface 40 in contact with a foam heat exchanger 45 . Similarly, the substrate 35 has a surface 50 in contact with a foam heat exchanger 55 . Fans 60 and 65 are used to move fluid through heat exchangers 45 and 55 respectively. Although fans 60 and 65 are shown passing air through heat exchangers 45 and 55, respectively, other types of mechanisms for moving other types of fluids may be used. Surfaces 40 and 50 may be integral to heat exchangers 45 and 55, respe...

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PUM

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Abstract

A thermoelectric system (10) for pumping heat having at least one foam heat exchanger (45) is provided that enhances heat transfer awayfrom the system (10) to increase overall system efficiency and performance of the system.

Description

technical field [0001] [0001] The present invention relates generally to foam heat exchangers, and more particularly, to an apparatus and method for using foam heat exchangers to enhance heat transfer in thermoelectric systems. Background technique [0002] [0002] The use of heat exchangers to remove heat in power electronics applications is well known. Heat exchangers or heat sinks are usually metal heat sinks designed to dissipate heat from power electronic components, especially power transistor modules, through thermal conduction, convection and radiation. The performance and reliability of power electronics without a heat exchanger will be reduced. [0003] [0003] Heat exchangers are often constructed to have a maximum number of fins per unit volume that radiate in a direction perpendicular to the surface being heated. In certain demanding applications, the heat exchanger uses forced convection to dissipate heat to the coolant passing through the heat exchanger to inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F28F7/00
CPCF28F13/003H01L35/30F25B2321/0251F25B21/02H10N10/13
Inventor A·A·阿拉亚里L·J·斯帕达奇尼于笑梅T·H·范德斯普尔特
Owner CARRIER CORP