Method for preparing multi-sheet printed circuit board

A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuit manufacturing, printed circuits, and assembling printed circuits with electrical components, can solve the problems of inability to use, reduce value, production time and labor costs, and simplify replacement. procedures, the effect of improving production efficiency
CN101299909AInactive Publication Date: 2008-11-05E TEEN +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
E TEEN
Publication Date
2008-11-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a method for preparing multi-sheet printed circuit board, which uses a qualified single slice printed circuit board cut down from a multi-sheet printed circuit through the secondary calibration incising procedure, to replace the unqualified single slice printed circuit board on a multi-sheet printed circuit board calibrated by a secondary calibration incising procedure of the top and bottom surfaces, which can improve replacement accuracy and simplify the prior replacement procedure, so as to boost productivity effect.
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Description

technical field

[0001] The invention relates to a method for improving the manufacture of printed circuit boards, in particular to a method for replacing unqualified single-chip areas in the manufacturing process of multi-piece printed circuit boards. Background technique

[0002] The English name of printed circuit board is Printed Circuit Board, or PCB for short. As the name suggests, printed circuit board is a circuit product made by printing technology. In the early days, circuit boards covered the surface of insulating boards by melting metal to make the required circuits. Because they can be mass-produced and the volume can be reduced, in addition to improving convenience, the price can also be reduced. After 1936, the circuit board manufacturing method was mainly to select the insulating substrate covered with metal with corrosion-resistant ink as the area, and remove the unnecessary area by etching. In recent decades, electronic products have developed rapidly. Prod...

Claims

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