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Packing box for transporting glass base plate

A technology of glass substrates and packaging boxes, applied in the direction of transportation and packaging, packaging of vulnerable items, types of packaging items, etc.

Inactive Publication Date: 2010-12-08
INNOCOM TECH (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In order to solve the problems of low safety and reliability, inconvenient packaging and high cost of glass substrate packaging boxes in the prior art during transportation, it is necessary to provide an improved A packaging box with high safety and reliability, convenient packaging and low cost during the transportation of glass substrates

Method used

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  • Packing box for transporting glass base plate
  • Packing box for transporting glass base plate
  • Packing box for transporting glass base plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] see image 3 , is a three-dimensional exploded schematic view of a preferred embodiment of the packaging box for transporting glass substrates of the present invention. The packaging box 40 includes a box body 42 and a cover body 44 , and the box body 42 and the cover body 44 are nested together to form a receiving space (not shown), and the receiving space is used for receiving glass substrates to be transported.

[0028] The box body 42 includes an outer buffer material 422 and an inner buffer material 424 . The outer buffer material 422 is located on the outside of the box body 42, the inner layer buffer material 424 is located on the inner side of the box body 42, and the outer layer buffer material 422 and the inner layer buffer material 424 are connected by four first positions. The side walls are matched with a bottom wall, the inner buffer material 424 is higher than the outer buffer material 422, and the inner buffer material 424 also encloses a rectangular st...

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Abstract

The invention relates to a packing box used for transporting glass substrates. The packing box comprises a box body that comprises an outer-layer buffer material and an inner-layer buffer material; the outer-layer buffer material is arranged at the outside of the inner-layer buffer material which is enclosed into a holding space; the expansion ratio of the inner-layer buffer material are larger that of the outer-layer buffer material, and the inner-layer buffer material is adulterated with antistatic substances. In the packing box, by arranging the inner-layer buffer material with the expansion ratio larger than that of the outer-layer buffer material, the impact of an external force is effectively buffered; the antistatic characteristic is added to the inner-layer buffer material so as to effectively avoid the damage to the glass substrates caused by static accumulation and improve the safety and reliability of the glass substrates during transporting process. Meanwhile, the usage ofantistatic films is reduced, thus being convenient for packing.

Description

technical field [0001] The present invention relates to a packaging box, in particular to a packaging box for transporting glass substrates. Background technique [0002] Glass is a brittle material. When it is hit by an external force or dropped to the ground, it is easy to break and become unusable. In the process of manufacturing the liquid crystal display panel, the transportation of the color filter substrate and the thin film transistor substrate is very important. For the production process of liquid crystal display panels, during the transportation process of the above-mentioned substrates, it is susceptible to chemical pollution, and when the substrates are rubbed with other packaging materials, it is very easy to cause the surface circuits of the color filter substrates and thin-film transistor substrates due to static electricity. or components are damaged. [0003] The delivery of glass substrates in the prior art is mainly to place the glass substrates in pack...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D85/48B65D81/02
Inventor 高淑惠万鸿明庄政道
Owner INNOCOM TECH (SHENZHEN) CO LTD
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