Thermal analysis test system based on infrared sequence image super-resolution reconstruction method

Abstract

The invention discloses a thermal analysis test system based on the infrared sequence image super-resolution reconstruction method. A photographing device, which is an non-refrigerating thermal infrared imager, is fixed on the x-y displacement platform of a photographing frame; a target which is in conducted state, such as a circuit, is fixed on the supporting pillar of the photographing frame. The non-refrigerating thermal infrared imager shoots the target to get the infrared sequence image of the target which is stored in a computer terminal through an interface arranged on the non-refrigerating thermal infrared imager. The super-resolution reconstruction method provided by the invention can be used to conduct the super-resolution reconstruction to the infrared sequence image of the target to get the resolution image of the target for analyzing. Under the condition that the photographing distance is fixed, the thermal analysis test system can get images, the resolution of which is much higher than the physical resolution of the photographing device.

Description

technical field [0001] The invention belongs to the technical field of testing, and specifically relates to a target thermal analysis testing system using an infrared sequence image super-resolution reconstruction method, which is mainly used for testing and analyzing the conduction of circuit board wires and device pins. Background technique [0002] At present, the progress of diagnosis technology of circuit board using infrared thermal imager at home and abroad is as follows: [0003] 1. The development history of foreign countries in this field. In 1969, the idea of ​​an infrared circuit board scanning system that could be used for testing electronic modules of the Minuteman missile was born. In the 1970s, Hughes Aerospace successfully developed IRFITS (Infrared Fault Isolation Test System) and AIDS (Automatic Infrared Test System), which can monitor weak circuit board thermal image signals and show possible fault areas to testers. In 1983, Hughes Aerospace successfull...

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Problems solved by technology

[0004] 2. There are also many domestic achievements in infrared thermal image diagnosis of circuit board faults

[0006] Looking at the results of thermal image diagnosis of circuit board faults at home and abroad, although the development is rapid, there are still some shortcomings, which are manifested in: due to the limitation of hardware conditions, the processing, display and storage of thermal image information need to rely on The dedicated digital processor, display and large-capacity memory make the peripheral equipment of the system complex and very dependent on the performance of the machine; only the static thermal image information is used, and the temperature change information (dynamic information) of the circuit board during the entire scanning process is not fully utilized. ); Professional testers are required to manually locate faults based on thermal image information

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