Packaging method for LED

Abstract

The invention relates to a packaging for a light emitting diode, comprising a light emitting diode crystal grain, a substrate and a radiating device. The substrate comprises a penetrating ceiling, a penetrating hole of the bottom, an anode and a cathode having intervals with the anode; at least a part of the crystal grain is in the penetrating hole, respectively connecting the anode and the cathode; the radiating device is fixed on the bottom of the substrate for covering at least a part of the penetrating hole; the crystal grain contacts to the radiating device. The invention can radiate the heat quickly and the invention can be thinner, which is quite practical.

Description

technical field [0001] The invention relates to a package of light-emitting diodes, in particular to a package of light-emitting diodes capable of rapid heat dissipation and thinning. Background technique [0002] At present, electronic devices such as mobile phones all emphasize light, thin and short shapes. Therefore, the package of the light-emitting diodes used in them should be as thin as possible. If the height of the mobile phone is not low enough, the user will feel uncomfortable when pressing the button, and the thickness of the mobile phone cannot be lowered, resulting in design restrictions. [0003] green refer to figure 1 As shown, the thickness of the general circuit board 11 is approximately equal to 0.1 millimeter (mm), and the height of the light-emitting diode grain 12 stacked on the top surface of the circuit board 11 is also approximately equal to 0.1 mm. For the light-transmitting outer cover 13 of the grain 12, the thinnest package 1 of the convention...

AI Technical Summary

Problems solved by technology

[0002] At present, electronic devices such as mobile phones all emphasize light, thin and short shapes. Therefore, the package of the light-emitting diodes used in them should be as thin as possible. If the height of the mobile phone is not low enough, the user will feel uncomfortable when pressing the button, and the thickness of the mobile phone cannot be lowered, resulting in design restrictions.

[0003] green refer to figure 1 As shown, the thickness of the general circuit board 11 is approximately equal to 0.1 millimeter (mm), and the height of the light-emitting diode grain 12 stacked on the top surface of the circuit board 11 is also approximately equal to 0.1 mm. The light-transmitting cover 13 of the grain 12, the thinnest package 1 of the known light-emitting diode can only achieve a thickness of 0.35 mm and cannot further reduce the height

[0004] Moreover, because the package 1 of the conventional light-emitting diode only conducts heat to the conductive path 111 of the circuit board 11 through two very thin metal wires 14, the heat conduction cross-sectional area in contact with the crystal grain 12 is very small, so the heat dissipation speed is very slow Then the heat energy is conducted from the end of the conductive path 111 on the top surface of the circuit board 11 to the end of the bottom surface of the circuit board 11, and the end of the conductive path 111 on the bottom surface of the circuit board 11 contacts with other circuit boards to dissipate heat, so it is necessary The heat can be conducted to the bottom surface of the circuit board 11 only after a very long heat dissipation path, so it takes a long time for heat dissipation, and it is easy to cause the crystal grain 12 to overheat without cooling down in time, and the service life of the crystal grain 12 will be shortened when overheating; especially if The packaging of light-emitting diodes with high brightness and higher temperature 1, too slow heat dissipation is a big problem

[0005] Thus it can be seen that the packaging of the above-mentioned existing light-emitting diodes obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

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