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LED module group capable of radiating and manufacturing method thereof

A technology of LED modules and manufacturing methods, applied in lighting and heating equipment, cooling/heating devices of lighting devices, electrical components, etc., can solve problems such as high cost, complicated production process, general heat dissipation effect and light effect, and achieve luminous The effect of small loss, good light effect and large light angle

Active Publication Date: 2008-12-24
漳州市大正电子科技有限公司
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  • Abstract
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Problems solved by technology

However, the aluminum frame structure added to the existing LED module board is not only complicated in production process and high in cost, but also has a general heat dissipation effect and light effect.
[0004] In summary, the existing LED module boards obviously have inconvenience and defects in actual use, so it is necessary to improve them

Method used

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  • LED module group capable of radiating and manufacturing method thereof
  • LED module group capable of radiating and manufacturing method thereof
  • LED module group capable of radiating and manufacturing method thereof

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Embodiment Construction

[0041] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0042] Figure 1 ~ Figure 3 The structural diagrams of the heat dissipating LED module board of the present invention are respectively shown. The heat dissipating LED module board 100 at least includes a metal plate 10, a circuit board 20 and a plastic part 30. The main function of the metal plate 10 is to quickly Absorb the heat emitted by the LED chip, and at the same time export the heat; the circuit board 20 mainly plays the role of wire and insulation; the main function of the plastic part 30 is to prevent the epoxy resin glue from overflowing when the LED chip is packaged, so as to facilitate...

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Abstract

The invention discloses a radiating LED module board which comprises a metal board, a circuit board and a plastic part; only the heat sinking part of the metal board is remained, and the parts are all removed except the heat sinking part; the heat sinking part of the circuit board is removed. The metal board and the circuit board are pressed fitly against each other and share the heat sinking part of the metal board. The plastic part is molded on the periphery of the heat sinking part of the metal board. Correspondingly, the invention also provides a manufacturing method of the radiating LED module board. Therefore, the invention has the advantages of fast radiation, good lighting effect, simple production technique and low cost, etc.

Description

technical field [0001] The invention relates to the field of LED products, in particular to a heat-dissipating LED module board and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a semiconductor solid light-emitting device. The core part of the LED is a wafer composed of P-type semiconductor and N-type semiconductor. When the current flows from the anode to the cathode of the LED, the semiconductor crystal emits light from the Light of different colors from purple to red, the intensity of the light is related to the magnitude of the current. Due to the advantages of long life, energy saving, and environmental protection, LEDs are increasingly favored by users. Currently, LEDs are not only widely used in the field of signal indication, but also in the field of lighting. [0003] LED is generally composed of several LED chips packaged on the LED module board, and the existing LED module board is mainly formed ...

Claims

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Application Information

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IPC IPC(8): F21V21/00F21V29/00H01L23/36H01L33/00F21Y101/02F21V29/70F21V29/89F21Y115/10H01L33/64
CPCH01L2924/0002
Inventor 欧阳俊
Owner 漳州市大正电子科技有限公司
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