System and method for testing image sensing wafer stain and

Abstract

The invention provides an image sensing wafer stain detection system, comprising an initialization setting module which is used for initially setting a quasi-stain standard value range and a stain standard value, an image acquiring module which is used for acquiring the brightness value of each pixel in the acquired image, a calculating module which is used for calculating the average and the standard difference value, a comparison module which is used for comparing the average and the standard difference value with the quasi-stain standard value range and the stain standard value respectively, and a labeling module which is used for labeling the quasi-stain in the quasi-stain standard value range and the stains exceeding the stain standard value range. The image sensing wafer stain detection system avoids the problems of subjective factors and residual error rate by manpower eye detection, and further improves the detection qualification rate. The invention also provides a detection method for the image sensing wafer stain detection system.

Description

technical field [0001] The present invention relates to a system for detecting the quality of an image sensing wafer, in particular to an image sensing wafer stain detection system and a detection method for detecting stains on the surface of the image sensing wafer. Background technique [0002] With the continuous development of science and technology, portable electronic devices such as mobile phones are widely used and tend to be light, beautiful and multi-functional. The camera function is an additional function of the popular mobile phones in recent years. A digital camera module used in a mobile phone must not only meet the requirements of thinness, lightness and compactness, but also have high photographic performance. However, as the pixels of the camera modules of digital cameras and mobile phones continue to increase, the imaging area of ​​the image sensing chip continues to shrink, which makes the single pixels more and more dense and smaller, so that even fine d...

AI Technical Summary

Problems solved by technology

[0003] At present, in the process of assembling image sensing chips, the detection of image sensing chips is mainly through manual visual inspection, that is, manually picking out image sensing chips with stains on the imaging surface one by one. Subjective factors, and there will be a large missed detection rate in the manual detection method, which will reduce the detection pass rate

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