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Method and apparatus for patterning a conductive layer, and a device produced thereby

A conductive layer and layout technology, which is applied in the manufacture of semiconductor devices, organic semiconductor devices, and semiconductor/solid-state devices, etc., and can solve problems such as the weakening of substrate barrier performance.

Inactive Publication Date: 2008-12-24
CIBA SPECIALTY CHEM HLDG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And the barrier properties of the substrate will be weakened

Method used

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  • Method and apparatus for patterning a conductive layer, and a device produced thereby
  • Method and apparatus for patterning a conductive layer, and a device produced thereby
  • Method and apparatus for patterning a conductive layer, and a device produced thereby

Examples

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Embodiment Construction

[0052] The following examples illustrate the invention. However, the present invention is not limited to these examples.

[0053] OLED:

[0054] Similar to that described in Figure 4, a 100 nm thick ITO anode was patterned on the compressible spacer layer. Samples were treated with air plasma (Harrick Plasma Cleaner PDC-002) for 2 minutes prior to spin-coat deposition. Preparation of tris(2,2'bipyridyl)ruthenium(II) hexafluorophosphate ([Ru(bpy) 3 ](PF 6 )) and a solution of polymethylmethacrylate (PMMA) with a molecular weight of 120000 g / mol. ([Ru(bpy) 3 ](PF 6 Two solutions of )) 40mg / ml and PMMA 25mg / ml were mixed in a volume ratio of 3:1. Films were prepared by spin coating at 1500 rpm, resulting in films of approximately 120-200 nm thickness. The device was dried on a hotplate at 100° C. for 1 hour under a nitrogen atmosphere. Without exposure to air, the device is placed in a vacuum chamber with a vacuum chamber of less than 10 -7 Base pressure in mbar. A 200...

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Abstract

A device is fabricated by a method in which a conductive layer or layer stack is formed over a compressible layer or layer stack, and contacted with an embossing tool. Raised portions of the embossing tool compress the compressible layer or stack and countersink the conductive layer or stack into the compressible layer or stack.

Description

technical field [0001] The present invention relates generally to the production of organic devices, such as organic light-emitting devices (OLEDs), organic field-effect transistors (OFETs) or organic photovoltaic cells, and more particularly to the patterning of conductive layers used in said organic devices. . Background technique [0002] The rapid development of organic device technology has increased the need for fast and cheap but reliable methods of depositing the required layers, as well as the need for patterning of said layers, especially of conductive layers. A method of mass production is required. Roll-to-roll processing of polymeric substrates is a promising approach. For most applications, due to the low stability of organic semiconductor and conductor materials with respect to oxygen and water, substrates are required to have good barrier properties. Barrier coatings are therefore typically deposited on polymeric substrates prior to the deposition of the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/05H01L51/40H01L51/50H01L51/56H10K99/00
CPCY02E10/549H10K71/211H10K71/621H10K85/113H10K85/344H10K10/462H10K71/821H10K71/40H10K2102/351H10K71/00
Inventor H·瓦尔特T·贝尔莱因
Owner CIBA SPECIALTY CHEM HLDG INC