Structure and method of fixing electronic parts to circuit board
一种电路基板、电子部件的技术，应用在用电元件组装印刷电路、非印制电元件相联接的印刷电路、电路等方向，能够解决电子部件对位偏移、无法有效安装作业、连接不可靠等问题，达到固定强度增大、安装作业高效化且自动化、固定可靠的效果
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no. 1 approach
[0083] Figure 1 to Figure 4 It is a figure which shows the mounting structure which mounts the electronic component to a circuit board concerning 1st Embodiment of this invention, figure 1 It is a perspective view seen from the upper side, figure 2 It is a perspective view seen from the bottom side, image 3 is a top view, Figure 4 is a schematic side sectional view ( image 3A-A profile). As shown in these figures, the mounting structure for mounting electronic components on a circuit board includes: a circuit board (hereinafter referred to as "flexible circuit board" in this embodiment) 10 on which a pair of terminal connection patterns 11 and 13 are formed; An electronic component (hereinafter referred to as a “light emitting component” in this embodiment) 50 having a pair of terminals (hereinafter referred to as “electrodes” in this embodiment) 51 and 53 is mounted on a flexible circuit board 10 , and The light-emitting component 50 and the peripheral portion of th...
no. 2 approach
[0094] Figure 12 It is an explanatory diagram of a manufacturing method of a mounting structure in which electronic components are mounted on a circuit board according to a second embodiment of the present invention, and corresponds to the above-mentioned embodiment. Figure 7 diagram. In the same figure, for the above Figure 1 to Figure 11 The same or equivalent parts in the embodiments shown in the above are assigned the same symbols (the same applies to the other embodiments below). Furthermore, for matters other than those described below, the same Figure 1 to Figure 11 The embodiment shown in is the same (the same applies to the other embodiments below). In this embodiment and the above Figure 1 to Figure 11 The only difference between the embodiments shown in FIG. like above Figure 1 to Figure 11 As in the embodiment shown in , a substrate fixing portion is formed on the outer portion where the two slits 17 and 19 face each other. If constituted in this way, ...
no. 3 approach
[0096] Figure 13 It is an explanatory diagram of a manufacturing method of a mounting structure in which electronic components are mounted on a circuit board according to a third embodiment of the present invention, and corresponds to the above-mentioned embodiment. Figure 7 diagram. In this embodiment and the above Figure 1 to Figure 11 The only difference between the embodiments shown in is that, by changing the shape of the slits 17, 19, only the tongue-shaped substrate fixing parts 25, 27 are provided on the opposite outer parts of the two slits 17, 19, unlike the above Figure 1 to Figure 11 As in the embodiment shown in , a side abutting portion is formed on the inner portion where the two slits 17 and 19 face each other. If constituted in this way, although the action and effect caused by the side contact portion will not be produced, the above-mentioned Figure 1 to Figure 11 All other actions and effects described in the embodiment shown in .
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