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Coil type chip encapsulation construction

A technology of chip packaging and structure, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of increasing production costs and achieve the effect of low production costs

Inactive Publication Date: 2009-02-04
CHIPMOS TECHSHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Please refer to Fig. 1, in the prior art, in order to solve this problem, usually when the reel 110 is installed with the reel 130 of the chip 120, another interlayer reel (Spacer) 140 is provided to make it and the reel. The tapes 130 are stacked together to form rolls to separate the coils of each layer, but the use of interlayer tapes 140 will increase the manufacturing cost

Method used

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  • Coil type chip encapsulation construction
  • Coil type chip encapsulation construction
  • Coil type chip encapsulation construction

Examples

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Embodiment Construction

[0019] Please refer to FIG. 2A and FIG. 2B , the tape and reel chip packaging structure 200 of the present invention has a tape 210 , a plurality of chips 220 and a plurality of spacing bumps 230 . The tape 210 is rolled up with a reel 300 . The reel 210 has a series of encapsulation areas 212 and two transport areas 214 , and the transport areas 214 are respectively located on two sides of the series of encapsulation areas 212 . The web 210 may also have a plurality of sprocket holes 216 located within the transfer areas 214 .

[0020] The chips 220 are respectively disposed on the series of packaging areas 212 of the tape 210 , and the spacer bumps 230 are disposed in the transmission areas 214 of the tape 210 . The height H1 of these chips 220 relative to the tape 210 is smaller than the height H2 of these spacer bumps 230 relative to the tape 210, so that when the tape 210 is rolled up, these chips 220 and the tape adjacent to the chip will be made There is a gap S betwe...

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Abstract

The invention discloses a tape chip package structure, comprising a tape, a plurality of chips and a plurality of spacing lugs. The tape has a series of enclosing areas and two transmission areas which are respectively arranged at two sides of the enclosing areas; and chips are respectively arranged on the enclosing areas. The spacing lugs are arranged in the transmission areas of the tape and can prevent the chips from directly contacting with the neighboring tape when the tape is rolled up.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a tape-and-reel chip packaging structure. Background technique [0002] There are many different types of printed circuit boards, some are rigid circuit boards, and some are flexible printed circuit boards (Flexible Printed Circuitry, FPC). Flexible circuit board is a kind of circuit board supported by soft dielectric materials, which can be used as flexible cables or applied in continuous dynamic bending products, and is currently used in the packaging of LCD driver ICs And mobile electronic products are especially extensive, such as mobile phones, notebook computers and digital cameras. [0003] The base layer of the flexible circuit board is a tape, and the chip is generally packaged in the form of Tape Automated Bonding (TAB). Package, TCP) and Chip-On-Film (COF) packaging. [0004] Generally, one end of the tape with the chip installed is fixed on the reel, and then th...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/13H01L23/498
Inventor 何政良
Owner CHIPMOS TECHSHANGHAI