Semiconductor package, method of manufacturing the same and system containing the package
A semiconductor and insulator technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as poor bonding and damage
Active Publication Date: 2013-03-20
SAMSUNG ELECTRONICS CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
As a result, the sidewalls of the openings in the encapsulation material can be damaged, which can also lead to poor bonding between the conductive pattern subsequently formed in the encapsulation material and the encapsulation material.
Method used
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[0032] Exemplary embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. These embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Throughout the specification, the same reference numerals refer to the same elements.
[0033] Figure 1A is a cross-sectional view of a first embodiment of a semiconductor package. Figure 1B is a cross-sectional view of a semiconductor package according to a modification of the first embodiment.
[0034] refer to Figure 1AFor example, semiconductor package 200 may include pillar 104, semiconductor chip 106 (herein also referred to as "fi...
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In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body. The first active surface is exposed by the first insulating body. The first back surface is substantially surrounded by the first insulating body. The semiconductor package includes a post within the first insulating body and adjacent to a side of the first semiconductor chip.
Description
[0001] This application claims priority to Korean Patent Application No. 2007-0080595 filed on August 10, 2007 and US Patent Application No. 12 / 104,333 filed on April 16, 2008. Its entire content is hereby incorporated by reference. technical field [0002] Embodiments illustratively described herein relate generally to semiconductor packages and methods of manufacturing the same. More specifically, embodiments illustratively described herein relate to semiconductor packages and their fabrication with increased bond strength between components within the semiconductor package, such as encapsulation materials, redistribution patterns, and / or dielectric materials. method. Other embodiments illustratively described herein relate to semiconductor packages with increased interconnection characteristics and reliability and methods of manufacturing the same. Background technique [0003] In the semiconductor industry, integrated circuit (IC) packaging technology continues to evol...
Claims
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IPC IPC(8): H01L23/48H01L23/31H01L25/00H01L25/18H01L23/488H01L21/50H01L21/56H01L21/60
CPCH01L24/96H01L25/0657H01L21/561H01L2225/06527H01L2224/97H01L2924/01047H01L21/6835H01L2225/06582H01L2924/01006H01L2924/01078H01L23/5389H01L21/568H01L2924/19041H01L2924/01079H01L2224/18H01L2924/14H01L2924/15311H01L2924/01005H01L2924/12041H01L2924/01082H01L2224/73267H01L2924/01013H01L2924/15331H01L2225/06524H01L24/82H01L2924/014H01L2224/32145H01L2225/06548H01L2225/06541H01L2924/01029H01L24/97H01L24/18H01L2924/01077H01L2924/01033H01L2224/12105H01L2924/181H01L2224/05008H01L2224/05548H01L2224/05568H01L2224/05001H01L2224/05124H01L2224/05139H01L2224/05144H01L2224/05147H01L2924/00014H01L2224/13023H01L2224/24226H01L24/19H01L2224/04105H01L2224/92244H01L2224/02377H01L2224/02379H01L2224/82H01L2924/00H01L2224/05599H01L23/48
Inventor 金坪完李泽勋张喆容
Owner SAMSUNG ELECTRONICS CO LTD