Packaging method for low-thermal resistance high-power light-emitting diode
A technology of light-emitting diodes and packaging methods, which is applied in the manufacture of electrical components, electrical solid devices, semiconductors/solid devices, etc. It can solve problems that affect the reliability of packaging, mismatch of thermal expansion coefficients of materials, residual thermal stress, etc., and achieve high reliability. , reduce thermal resistance, improve the effect of heat dissipation
Active Publication Date: 2010-11-10
GUANGDONG REAL FAITH LIGHTING TECH
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Problems solved by technology
In recent years, there is a trend of gradually adopting high thermal conductivity conductive adhesive, solder paste or eutectic solder. Although its thermal resistance is low, due to the mismatch of thermal expansion coefficient of the material, residual thermal stress is easy to occur during high temperature curing, reflow or eutectic soldering , affecting package reliability
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Abstract
The invention discloses a packaging method of a low thermal resistance and high power light emitting diode (LED). The LED mainly comprises a light emitting chip, electrodes, wire leads, a metal substrate and colloidal silica with fluorescent powder. The invention is characterized in that the metal substrate is deposited on the bottom surface of the light emitting chip through a plating technique.The invention has the advantages that the packaging thermal resistance is effectively reduced and the packaging heat-sinking capability of the high power LED because the light emitting chip is directly positioned on the metal substrate and no middle bonding layer such as a solder is in the middle, and the packaging method can realize batch manufacture of LED array packaging modules, has high reliability and low cost.
Description
Packaging method of low thermal resistance and high power light emitting diode Technical field The invention relates to a high-power light-emitting diode, in particular to a packaging method of a low-thermal resistance high-power light-emitting diode. Background technique Light-emitting diode LED has the advantages of low power consumption, high luminous efficiency, short response time, small size, light weight, pure light color and long life. It is regarded by the industry as the main direction of the lighting source market and has strong market potential. For LED, the main reasons for its failure include current overload, overheating (overheating) and package failure. Since only 10%-20% of the input electrical energy is converted into light, and the rest is converted into heat, the heat dissipation of the chip is the primary problem that must be solved in LED packaging. The temperature rise of the pn junction caused by poor heat dissipation will seriously affect the emissio...
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IPC IPC(8): H01L21/50H01L33/00H01L33/48H01L33/64
CPCH01L2224/48091H01L2924/181
Inventor 刘胜陈明祥罗小兵刘宗源王恺甘志银
Owner GUANGDONG REAL FAITH LIGHTING TECH