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Cavity inner lining and reaction cavity

A reaction chamber and lining technology, applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problems of lack of plasma uniformity, achieve the effect of protecting the side wall and improving the uniformity

Active Publication Date: 2011-04-27
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned prior art has at least the following disadvantages: the inner liner 9 can only protect the side wall 3 of the reaction chamber, and cannot improve the uniformity of the plasma in the reaction chamber

Method used

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  • Cavity inner lining and reaction cavity
  • Cavity inner lining and reaction cavity
  • Cavity inner lining and reaction cavity

Examples

Experimental program
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Embodiment Construction

[0013] Chamber liner and chamber liner of the present invention, its preferred specific embodiment is as figure 2 As shown, the chamber lining includes an outer lining 17 and an inner lining 12, and there is a gap 13 between the outer lining 17 and the inner lining 12, and the inner lining 12 has a plurality of A through hole 14, an air inlet 5 is opened on the outer lining 17, and an exhaust outlet 6 is opened on the inner lining 12.

[0014] The edges of the through holes 14 may be chamfered or rounded to reduce resistance to airflow.

[0015] The diameter of the through hole is less than or equal to 6 mm, which can shield the plasma to a certain extent.

[0016] The inner lining of the chamber is arranged inside the reaction chamber. The reaction chamber includes a side wall 3 and a bottom wall. The air inlet 5 on the outer lining 17 communicates with the outside of the reaction chamber through the side wall 3. The inner lining The exhaust port 6 on 12 communicates with ...

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PUM

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Abstract

The invention discloses a lining of a chamber and a reaction chamber. The lining comprises an outer layer of lining and an inner layer of lining; a gap is reserved between the outer layer of lining and the inner layer of lining; a plurality of through holes are formed on the inner layer of lining; an air inlet is formed on the outer layer of lining and communicated with the external part of the reaction chamber; an air discharge port is formed on the inner layer of lining and communicated with the external part of the reaction chamber; a process gas enters the gap between the outer layer of lining and the inner layer of lining from the air inlet, and enters the inside of the reaction chamber through the plurality of through holes on the inner layer of lining. The lining has a certain buffer function for the process gas, can protect the side walls of the reaction chamber and improve the uniformity of plasma inside the reaction chamber.

Description

technical field [0001] The invention relates to a semiconductor processing equipment component, in particular to a chamber lining and a reaction chamber. Background technique [0002] Plasma-based semiconductor processing is commonly used during semiconductor processing, particularly during etching, oxidation, chemical vapor deposition (CVD), and the like. Conventional plasma processing systems typically control the gas flow, or plasma flow, within the reaction chamber to provide an optimal environment for processing wafers. Non-uniform distribution of process gases within the reaction chamber can adversely affect the uniform distribution of the plasma. In the prior art, the uniformity of the plasma in the chamber is generally improved by improving the air intake method of the reaction chamber, for example, using various shapes of gas distribution plates, nozzles, and the like. [0003] like figure 1 As shown, the reaction chamber in the prior art includes a window 2 of a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/205H01L21/3065H01L21/316H01L21/67C23C16/44C23F4/00H05H1/00H01J37/32
Inventor 管长乐
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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